Device: Am29DL163CB [TSOP48]
Manufacturer: Spansion
Part number description for this device:
Move the cursor over the box to highlight particular section| Am | AMD Products | |
| XXXX | Family Signature | 29DL = 3V, Simuiltaneous Read/Write |
| XXX | Density, Bus Width and Sector Organization | 16x = 2Mx8 / 1Mx16 32x = 4Mx8 / 2Mx16 400 = 512kx8 / 256kx16 640 = 8Mx8 / 4Mx16 800 = 1Mx8 / 512kx16 |
| X | Process Technology | B = 0.32 um technology C = 0.32 um thin-film technology D = 0.23 um thin-film technology G = 0.17 um thin-film technology H = 0.13 um thin-film technology M = MirrorBit technology |
| XX | Sector Architecture and Sector Write Protection | U, Blank = Uniform sector device B = Bottom boot sector T = Top boot sector H = Uniform sector device, highest address sector protected L = Uniform sector device, lowest address sector protected J40 = (Ultra NAND only) 100\% usable blocks |
| XXX | Speed Option, Voltage regulation | **(*) = 2 or 3 digits indicates speed in ns, device is full voltage range, Vcc=2.7V to 3.6V **(*)R = 2 or 3 digits indicate speed in ns, „R“ indicates regulated voltage range Vcc=3V to 3.6V |
| X | Package Type | P = Plastic DIL J = Plastic LCC S = SOP Z = SSOP E = TSOP E2 = TSOP II F = Reverse TSOP F2 = Reverse TSOP II 0.8mm ball pitch (unless otherwise noted) : MA = 63-ball FBGA (11x12mm) VA = 44-ball FBGA (9.2x8mm, 0.5mm pitch) VR = 48-ball, VFBGA (8.15x6.15mm) WA = 48-ball FBGA (6x8mm) WB = 48-ball, FBGA (6x9mm) WC = 48-ball, FBGA (8x9mm) WD = 63-ball, FBGA (8x14mm) WG = 40-ball, FBGA (8x15mm) WH = 63-ball, FBGA (12x11mm) WK = 47-ball, FBGA (7x10mm, 0.5mm pitch) WL = 48-ball, (11x10mm, 0.5mm pitch) WM = 48-ball, (6x12mm) WN = 84-ball, FBGA(11x12mm) 1.0mm ball pitch (unless othervise noted) : PA = 64-ball, BGA (13x11mm, 1.7mm) PB = 80-ball, BGA (13x11mm) PC = 64-ball, BGA (13x11mm) PE = 80-ball, BGA(10x15mm) |
| X | Temperature Range | C = Commercial I = Industrial E = Extended |
| X | Optional Proccessing | Blank = Standard Proccessing N = ESN devices B = Burn-in |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: Bottom TSOP48 NOR-1 (70-1227) + Top TSOP48 ZIF 18.4mm (70-1228) Top TSOP48 ZIF 18.4mm (70-1228) + Top TSOP48 ZIF 18.4mm (70-1228) |
| BeeHive204AP | adapter/module: AP1 TSOP48 ZIF 18.4mm NOR-1 (71-1988) |
| BeeHive208S | adapter/module: Bottom TSOP48 NOR-1 (70-1227) + Top TSOP48 ZIF 18.4mm (70-1228) Top TSOP48 ZIF 18.4mm (70-1228) + Top TSOP48 ZIF 18.4mm (70-1228) |
| BeeProg2 | adapter/module: Bottom TSOP48 NOR-1 (70-1227) + Top TSOP48 ZIF 18.4mm (70-1228) Top TSOP48 ZIF 18.4mm (70-1228) + Top TSOP48 ZIF 18.4mm (70-1228) |
| BeeProg2AP | adapter/module: AP1 TSOP48 ZIF 18.4mm NOR-1 (71-1988) |
| BeeProg2C | adapter/module: Bottom TSOP48 NOR-1 (70-1227) + Top TSOP48 ZIF 18.4mm (70-1228) Top TSOP48 ZIF 18.4mm (70-1228) + Top TSOP48 ZIF 18.4mm (70-1228) |
| BeeHive204AP-AU (discontinued) | adapter/module: AP1 TSOP48 ZIF 18.4mm NOR-1 (71-1988) |
