Device: SP9MAGP3AMI01 [BGA153]
Manufacturer: Smart Modular
Part number description for this device:
Move the cursor over the box to highlight particular section| SH | SMART Modular | SH = Halogen-free |
| 8 | Integrated Memory Solution | |
| X | Product Family | M = eMMC |
| XXX | Device Density | 08G = 8GB 16G = 16GB 32G = 32GB |
| X | Package Type | A = 100-ball 14.0x18.0 C = 169-ball 12.0x16.0 |
| X | Package Thickness | A = 1.0mm C = 1.2mm E = 1.4mm |
| XX | NAND+MCU Configuration Code | TC = Toshiba 19mm 64Gb B-die + Phison PS8210DC All others reserved |
| XX | Firmware Base Code Version | EC = Standard 4.51 + FW v1 All others reserved |
| X | Shipping Media | A = Tray T = Tape & Reel All others reserved |
| X | Operating Temperature | E = Extended -25°C to 85°C I = Industrial -40°C to 85°C A = Automotive -40°C to 85°C plus additional testing |
| XXX | Product Configuration | 01_ = Base configuration All others reserved |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331) |
| BeeHive208S | adapter/module: DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331) |
| BeeHive304 | adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040) |
| BeeProg2 | adapter/module: DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331) |
| BeeProg2C | adapter/module: DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331) |
| BeeProg3 | adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040) |
