Device: S3F8S28 [SOP20]
Manufacturer: Samsung
Part number description for this device:
Move the cursor over the box to highlight particular section| S | System LSI | |
| 3 | Microcontroller | |
| X | Family Type | C = Mask ROM F = FLASH 3 = MCP E = EVA-CHIP P = OTP |
| X | Core | 1 = 51 4-bit 2 = 32-bit ARM9 3 = 17 16-bit 4 = 32 32-bit 5 = 32-bit ARM10 6 = 56 4-bit 7 = 57 4-bit 8 = 88 8-bit 9 = 86 8-bit A = 15 Other B = 8-bit CALM RISC MAC C = 16-bit CALM RISC MAC D = 32-bit CALM RISC MAC I = Custom MCU J = SC-200 K = 8-bit CALM RISC L = 16-bit CALM RISC R = 128-bit CALM RISC S = SC-100 |
| XX | Application Category | 0n = General Purpose 1n = Voice 2n = LCD 3n = Audio 4n = General A/D 5n = Telecom 6n = PC & Peripherial, OA 7n = VFD 8n = Video 9n = Special (IC Card) An = General Purpose-1 Cn = C Fn = Telecom-1 Nn = Intel Application Zn = Assigment Code "n" Serial No. (1~Z) |
| X | ROM Master | 0ROMless 1 = 1kx8 2 = 2kx8 3 = 12kx8 4 = 4kx8 5 = 16kx8 6 = 6kx8 7 = 24kx8 8 = 8kx8 9 = 32kx8 A = 48kx8 B = 64kx8 C = 96kx8 D = 128kx8 F = 256kx8 G = 384kx8 H = 512kx8 J = 768kx8 K = 1Mx8 W = 144kx8 |
| X | Version | |
| XX | Mask Option | |
| XX | Package Type | A = SDIP B = LGA C = Chip BIZ D = DIP E = LQFP F = WQFP G = BGA H = CSP J = BQFP K = UELP L = ELP M = QFPH N = COB P = PLCC R = TSSOP Q = QFP S = SOP T = TQFP V = SSOP W = Waffer Y = FBGA Z = SBGA |
| X | Package Pin | SDIP package: B=56, M=24, O=32, Q=42, T=64, V=30 LGA package: A=88, C=83, J=176 DIP package: C=8, H=16, I=18, K=20, N=28, P=40 LQFP package: C=144, D=160, E=208, G=256, J=176, R=48, T=64, W=80, X=100 WQFP package: T=64 BGA package: A=272, B=416, C=496, D=153 CSP package: J=176 BQFP package: B=132 UELP package: T=64 ELP package: R=48, T=64 QFPH package: D=160, F=240 COB package: C=8, D=8CNCL PLCC package: C=52, Z=44 TSSOP package: R=48 QFP package: A=128, C=144, D=160, E=208, G=256, R=48, T=64, U=304, W=80, X=100, Z=44 SOP package: C=8, H=16, I=18, K=20, M=24, N=28, O=32 TQFP package: A=128, T=64, W=80, X=100 TEBGA package: X=492 FBGA package: A=337, B=81, C=144, D=160, E=208, F=180, G=285, H=320, K=105, L=400, O=272, P=504, Q=289, T=64, U=83, X=100 SBGA package: A=432 SSOP package: H=16, K=20 |
| X | Packing | B = Tube U = Bulk R = Tray T = Tape & Reel S = Tape & Reel reverse C = Chip Biz D = Chip Biz (3 inch tray) E = Chip Biz (4 inch tray) F = Chip Biz (reverse) W = WF Biz Draft Wafer X = WF Biz Full Cutting 7 = Tape & Reel (Pb-Free PKG) 8 = Tray (Pb-Free PKG) 9 = Tube (Pb-Free PKG) |
| X | ROM Size | 0ROMless 1 = 1kx8 2 = 2kx8 3 = 12kx8 4 = 4kx8 5 = 16kx8 6 = 6kx8 7 = 24kx8 8 = 8kx8 9 = 32kx8 A = 48kx8 B = 64kx8 C = 96kx8 D = 128kx8 E = Extended F = 256kx8 G = 384kx8 H = 512kx8 J = 768kx8 K = 1Mx8 M = Military N = Industrial W = 144kx8 X = Special MK3 Y = Special MK2 Z = Special MK1 |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: DIL20W/SOIC20 ZIF 300mil (70-0879) |
| BeeHive204AP | adapter/module: AP1 SOIC20 ZIF 300mil (71-1842) |
| BeeHive208S | adapter/module: DIL20W/SOIC20 ZIF 300mil (70-0879) |
| BeeProg2 | adapter/module: DIL20W/SOIC20 ZIF 300mil (70-0879) |
| BeeProg2AP | adapter/module: AP1 SOIC20 ZIF 300mil (71-1842) |
| BeeProg2C | adapter/module: DIL20W/SOIC20 ZIF 300mil (70-0879) |
| BeeHive204AP-AU (discontinued) | adapter/module: AP1 SOIC20 ZIF 300mil (71-1842) |
