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Device: KMAFG0000A-S998 [FBGA153]

Manufacturer: Samsung

Part number description for this device:

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K Memory  
M MOVI NAND/MCP  
X Small Classification A = NAND+MCU
B = NAND+NAND+MCU
C = NAND+NAND+NAND+NAND+MCU
D = NAND+NAND+NAND+MCU
H = NAND+NAND+NAND+NAND+NAND+NAND+NAND+NAND+MCU
X = moviNAND+NAND+SDRAM
Y = moviNAND+OneNAND+SDRAM
Z = moviNAND+NAND+SDRAM+SDRAM
X moviNAND Density/NAND Density/Cell/Vcc/Vccq/Organization 0None
A = 512MByte / 2G*2 / SLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
B = 1GByte / 2G*4 / SLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
C = 2GByte / 4G*4 / SLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
D = 2GByte / 8G*2 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
E = 4GByte / 8G*4 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
F = 1GByte / 8G*1 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
G = 1GByte / 4G*2 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
H = 3GByte / 8G*3 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
I = 512MByte / 4G*1 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
J = 8GByte / 8G*8 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
K = 2GByte / 16G*1 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
L = 4GByte / 16G*2 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
M = 8GByte / 16G*4 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
N = 12GByte / 16G*6 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
O = 16GByte / 16G*8 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
P = 256MByte / 2G*1 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
Q = 128MByte / 1G*1 / SLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
X LSI A = S3C49RAX01
D = S3C49NBX01
E = S3C49VCX01
F = S3C49VCX02
G = S3C49VCX03
N = S3C49VAX02
X NOR Flash Density/Vcc/Vccq/Organization/Type/Option 0None
X NAND/OneNAND Density/Vcc/Vccq/Organizaton/Option 0None
A = 2G / 1.8V / 1.8V / x8 / SLC
B = 1G OneNAND / 1.8V / 1.8V / x16 / Muxed
C = 1G OneNAND / 1.8V / 1.8V / x16
D = 2G NAND_0 / 1.8V / 1.8V / x8
E = 512M / 2.7V / 2.7V / x8
F = 2G NAND_0 / 1.8V / 1.8V / x16 / SLC
X UtRAM/SRAM Density/Vcc/Vccq/Organization/Option 0None
X DRAM I/F /Density/Vcc/Vccq/Organization/Option 0None
A = MDDR*2 / 1G+512M / 1.8V / 1.8V / x32
B = MDDR*2 / 512Mx2 / 1.8V / 1.8V / x32
C = MDDR / 1G / 1.8V / 1.8V / x32
D = MDDR*2 / 1G*2 / 1.8V / 1.8V / x32
E = SDR / 256M / 1.8V / 1.8V / x32
F = MDDR / 1G / 1.8V / 1.8V / x16
X Generation M = 1st generation
A = 2nd generation
B = 3rd generation
C = 4th generation
X Package Type A = FBGA (Hallogen-free, Lead-free)
B = FBGA (Halogen-free, OSP lead-free)
D = FBGA (Lead-free)
E = LGA (No ball)
F = FBGA
H = LGA (Lead-free)
P = FBGA (OSP)
Q = TSOP (Lead-free)
S = FBGA (MoviNAND special 2)
Z = FBGA (MoviNAND special 1)
X Chip Qty 1 = 1 chip
2 = 2 chip
3 = 3 chip
4 = 4 chip
5 = 5 chip
6 = 6 chip
XXX Serial Number 300 = 19ns, 12ns, 7.5ns
301 = 19ns, 42ns, 7.5ns
302 = 19ns, 12ns, 6ns
400 = 19ns(2), 42ns, 7.5ns
401 = 19ns, 42ns, 6ns, 6ns
402 = 19ns(2), 42ns, 6ns
403 = 19ns(2), 12ns, 6ns
500 = 19ns(2), 42ns, 6ns, 6ns
501 = 19ns(2), 42ns, 7ns, 6ns
600 = 19ns(4), 42ns, 7.5ns
601 = 19ns(4), 42ns, 6ns
700 = 19ns, 42ns, 7.5ns, 7.5ns
701 = 19ns(4), 42ns, 6ns, 6ns
998 = moviNAND normal
999 = Daisychain sample
X Packing Type T = Tape&Reel
0Other (Tray, Tube, Jar)
S = Stack
P = Module Tape&Reel
M = Module other packing
XX Customer (Customer List Reference)  

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeHive208S adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeHive304 adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040)
BeeProg2 adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeProg2C adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeProg3 adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040)
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