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Device: KLMCG8GEAC-B001 [FBGA153]

Manufacturer: Samsung

Part number description for this device:

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K Memory  
L MOVI NAND, MCP  
X NAND Function E = Error free NAND
S = eSSD
C = Cartridge SIP
L = LBA NAND
M = moviNAND
XX Embedded NAND Density 28 = 128MByte
56 = 256MByte
12 = 512MByte
1G = 1GByte
2G = 2GByte
3G = 3GByte
4G = 4GByte
8G = 8GByte
AG = 16GByte
BG = 32GByte
CG = 64GByte
DG = 128GByte
X Composition 1 = NAND1 + Microcontroller
2 = NAND2 + Microcontroller
3 = NAND3 + Microcontroller
4 = NAND4 + Microcontroller
8 = NAND8 + Microcontroller
X NAND Small Clasification(Type/Density) A = MLC/2GBit, Multi bit level cell (2bit)
B = MLC/4GBit, Multi bit level cell (2bit)
C = MLC/8GBit, Multi bit level cell (2bit)
D = MLC/16GBit, Multi bit level cell (2bit)
E = MLC/32GBit, Multi bit level cell (2bit)
Z = 3bit MLC/16GBit, Multi bit level cell (3bit, 4bit)
1 = SLC, 1GBit, Single bit level cell
9 = SLC, 2Gbit (x16 NAND Oprion), Single bit level cell
X Supply Voltage, Mode A = Vcc=2.5V to 3.6V, Vccq=2.5V to 3.6V, single mode
B = Vcc=2.5V to 2.9V, Vccq=None, single mode
C = Vcc=2.5V to 3.6V, Vccq=1.65V to 1.95V, single mode
D = Vcc=1.65V to 1.95V, Vccq=2.5V to 3.6V, single mode
E = Vcc=2.5V to 3.6V, Vccq=1.65V to 1.95V, or 2.5V to 3.6V, dual mode
Q = Vcc=1.7V to 1.95V, Vccq=None, single mode
U = Vcc=2.7V to 3.6V, Vccq=None, single mode
X Controller A = S3C49RAA01
D = S3C49VDX01
E = S3C49VDX03
M = MSP1010
N = S3C49NBX01
O = S3C49NBX02
R = S3C49RAX01
S = SK6626
T = S3C49TBX01
V = S3C49VCX03
X Component Generation (NAND Generation) M = 1st generation
A = 3nd generation
B = 3rd generation
D = 5th generation
E = 6th generation
X = NAND option
X Package Type A = FBGA(Halogen-free, lead-free, OSP)12x16
B = FBGA(Halogen-free, lead-free, OSP)
S = FBGA(OSP Lead-free)
I = LGA(Halogen-free, Lead-free)
L = LGA(Lead-free)
P = TSOP(Lead-free)
X Revision 0None
1 = EVT1
2 = EVT2
3 = EVT3
4 = EVT4
X Speed 0None
X Reserved 1 = Normal sample
2 = Premium sample

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeHive204AP adapter/module: AP1 BGA153-1.01 eMMC-1 (71-3322)
BeeHive208S adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeHive304 adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040)
BeeProg2 adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeProg2AP adapter/module: AP1 BGA153-1.01 eMMC-1 (71-3322)
BeeProg2C adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeProg3 adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA153-1.01 eMMC-1 (71-3322)
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