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Device: K9WAG08U1B [TSOP48]

Manufacturer: Samsung

Part number description for this device:

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K Device Type K = Memory
9 Family Descriptor 9 = NAND Flash
X Small Classification 1 = SLC 1 Chip XD Card
2 = SLC 2 Chip XD Card
3 = 4bit MLC Mono
4 = SLC 4 Chip XD Card
5 = MLC 1 chip XD card
6 = MLC 2 chip XD card
7 = SLC moviNAND
8 = MLC moviNAND
9 = 4bit MLC ODP
A = 3bit MLC MONO
B = 3bit MLC DDP
C = 3bit MLC QDP
E = SLC Dual (S/B)
F = SLC Normal
G = MLC Normal
H = MLC QDP
J = Non-muxed One Nand
K = SLC Die Normal, SLC Die stack
L = MLC DDP
M = MLC DSP
N = SLC DSP
O = 3bit MLC ODP
P = MLC ODP
Q = SLC ODP
R = MLC 12-die stack
S = MLC 6-die stack
T = SLC Single (S/B)
U = MLC 16-die stack
W = SLC 4 Die Stack
Note:
SLC = Single Level Cell
MLC = Multi Level Cell
SM = SmartMedia
S/B = Small Block
XX Density 00 = None
40 = 4Mbit
80 = 8Mbit
16 = 16Mbit
32 = 32Mbit
64 = 64Mbit
28 = 128Mbit
56 = 256Mbit
12 = 512Mbit
1G = 1Gbit
2G = 2Gbit
4G = 4Gbit
8G = 8Gbit
AG = 16Gbit
LG = 24Gbit
BG = 32Gbit
ZG = 48Gbit
CG = 64Gbit
NG = 96Gbit
DG = 128Gbit
EG, FG = 256Gbit
GG = 384Gbit
HG = 512Gbit
X Technology 0Normal (x8)
1 = Normal (x16)
C = Catridge SIP
D = DDR
M = moviNAND
N = moviNAND FAB
P = moviMCP
T = Premium eSSD
Z = SSD
X Organization 0None
6 = x16
8 = x8
X Supply Voltage 0None
A = 1.65V to 3.6V
B = 2.5V to 2.9V
C = 4.5V to 5.5V
D = 2.4V to 2.9V
E = 2.3V to 3.6V
R = 1.65V to 1.95V
Q = 1.7V to 1.95V
S = 3,0V to 3,6V / Vccq 1,65V to 1,95V
T = 2.4V to 3.0V
U = 2.7V to 3.6V
V = 3.0V to 3.6V
W = 2.7V to 5.5V, 3.0V to 5.5V
X Mode 0Normal
1 = Dual nCE & Dual R/nB
3 = Tri nCE & Tri R/nB
4 = Quad nCE & Single R/nB
5 = Quad nCE & Quad R/nB
6 = 6 nCE & 2 RnB
7 = 8 nCE & 4 RnB
8 = 8 nCE & 2RnB
9 = 1st block OTP
A = Mask Option 1
L = Low grade
X Generation M = 1st generation
A = 2nd generation
B = 3rd generation
C = 4th generation
D = 5th generation
E = 6th generation
...
Y = 25th generation
Z = 26th generation
X Package Type 8 = TSOP1 (Leed-free, halogen-free, CU)
9 = 56TSOP1 (Lead-free, halogen-free, CU)
A = COB
B = FBGA (Lead-free, halogen-free)
D = 63-TBGA
E = ISM (Lead-free, halogen-free)
F = WSOP (Lead-free)
G = FBGA
H = BGA (Lead-free, halogen-free)
I = ULGA (Lead-free) (12*17)
J = FBGA (Lead-free)
K = ULGA (Lead-free, halogen-free) (12*17)
L = ULGA (Lead-free, halogen-free) (14*18)
M = 52-ULGA (Lead-free, halogen-free) (13*18)
P = TSOP1 (Lead-free)
Q = TSOP2 (Lead-free)
R = 56-TSOP1 (Lead-free, halogen-free)
S = TSOP1 (Lead-free, halogen-free)
T = WSOP (Lead-free, halogen-free)
U = COB (MMC)
V = WSOP
W = Wafer
Y = TSOP1
Z = WELP (Lead-free)
X Temperature Range C = Commercial
I = Industrial
S = SmartMedia
B = SmartMedia BLUE
0None
X Customer Bad Block B = Include bad block
D = Daisychain sample
K = Special handling
L = 1 to 5 bad block
N = Ini. all good, add. 10 blocks
S = All good block
0None (containing wafer, chip, BIZ, exception handling code)
X Pre-Program Version 0None
Serial (1~9, A~Z)
X Packing T = Tape&Reel
0Other (Tray, Tube, Jar)
S = Stack
XX Customer („customer list reference“)  

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeHive204AP adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097)
BeeHive208S adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeProg2 adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeProg2AP adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097)
BeeProg2C adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeHive204AP-AU (discontinued) adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097)
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