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Device: K8D6316UTM [TBGA48]

Manufacturer: Samsung

Part number description for this device:

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K8 Samsung NOR Flash Memory  
D Device Type D = Dual Bank Boot Block
XX Bank Division 17 = 8Mbits + 8Mbits
32 = 8Mbits + 24Mbits
33 = 16Mbits + 16Mbits
63 = 16Mbits + 48Mbits
65 = 32Mbits + 32 Mbits
XX Organization 16 = x8 / x16 selectable
X Operating Volatage Range U = 2.7V to 3.6V
X Block Architecture T = Top Boot Block
B = Bottom Boot Block
X Version Blank
M = 1st generation
A = 2nd generation
X Package Type P = TSOP48 (Lead-Free)
Y = TSOP48
D = FBGA (Lead-Free)
F = FBGA
L = TBGA (Lead-Free)
T = TBGA
X Operating Temperature Range C = Commercial
I = Industrial
XX Access Time 07 = 70ns
08 = 80ns
09 = 90ns
12 = 120ns

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0245/0273 (70-0245/0273) = BGA-Bottom-1 (70-0245) + BGA-Top-15 ZIF-CS (70-0273)
BeeHive208S adapter/module: BGA-0245/0273 (70-0245/0273) = BGA-Bottom-1 (70-0245) + BGA-Top-15 ZIF-CS (70-0273)
BeeProg2 adapter/module: BGA-0245/0273 (70-0245/0273) = BGA-Bottom-1 (70-0245) + BGA-Top-15 ZIF-CS (70-0273)
BeeProg2C adapter/module: BGA-0245/0273 (70-0245/0273) = BGA-Bottom-1 (70-0245) + BGA-Top-15 ZIF-CS (70-0273)
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