Device: K522F1HACB [FBGA107]
Manufacturer: Samsung
Part number description for this device:
Move the cursor over the box to highlight particular section| K5 | Samsung MCP (2 chips) | |
| X | Device Type | 1 = NAND flash + mobile SDR 2 = NAND flash + mobile DDR |
| XX | NAND Flash Density, Organisation | 1F = 1Gbit, x8 1H = 1Gbit, x16 2F = 2Gbit, x8 2H = 2Gbit, x16 4G = 4Gbit, x16 |
| XX | RAM Density, Organisation | 12 = 512Mbit, x16 16 = 512Mbit, x32 1H = 1Gbit, x16 2G = 2Gbit, x32 57 = 256Mbit, x16 58 = 256Mbit, x32 |
| X | Operating Voltage | A = 1.8V / 1.8V |
| X | Flash Block Architecture | C = Uniform block |
| X | Version | M = 1st generation A = 2nd generation B = 3rd generation C = 4th generation etc. |
| X | Package Type | A, B = FBGA (HF, OSP LF) |
| X | NAND Flash Speed | 0None |
| XX | RAM Speed | 50 = 5.0ns (200MHz@CL3) 60 = 6.0ns (166MHz@CL3) 75 = 7.5ns (133MHz@CL3) |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: DIL48/BGA107-1 ZIF NAND-1 (70-3112) |
| BeeHive208S | adapter/module: DIL48/BGA107-1 ZIF NAND-1 (70-3112) |
| BeeProg2 | adapter/module: DIL48/BGA107-1 ZIF NAND-1 (70-3112) |
| BeeProg2C | adapter/module: DIL48/BGA107-1 ZIF NAND-1 (70-3112) |
