Device: M24C32
Manufacturer: STMicroelectronics
Part number description for this device:
Move the cursor over the box to highlight particular sectionM | STMicroelectronics | |
XX | Family Descriptor | 24 = IIC serial EEPROM 34 = Application specific IIC serial EEPROM |
X | Technology | Blank C = CMOS |
X | Description | Blank A = For ACR PC cards C = For DRAM DIMMs |
XXX | Density | 00 = 384bit (3x128) 01 = 1kbit 02 = 2kbit 04 = 4kbit 08 = 8kbit 16 = 16kbit 32 = 32kbit 64 = 64kbit 128, 128-B = 128kbit 164 = 16kbit 256, 256-B = 256kbit 512 = 512kbit M01 = 1Mbit M02 = 2Mbit |
X | Clock Frequency | Blank = fCmax=400kHz H = fCmax=1MHz |
X | Option | Blank D = Additional identification page |
XX | Operating Voltage | Blank = 4.5V to 5.5V (400kHz) V, BV = 2.5V to 3.6V (400kHz) W, AW, BW = 2.5V to 5.5V (400kHz) S, BS = 1.8V to 3.6V (400kHz) R, BR = 1.8V to 5.5V (100kHz) F = 1.7V to 5.5V L = 2.2V to 5.5V |
XX | Package Type | BN = Plastic DIP8 MC = UFDFPN8 (MLP8) MN = SOIC8 (150mil) MW = SOIC8 (200mil) DW = TSSOP8 DL = TSSOP14 MB = UFDFPN8 (MLP8 2x3mm) DS = TSSOP8 (3x3mm body size, MSOP8) CS = WLCSP CT = Thin WLCSP |
X | Temperature Range | 1 = 0°C to 70°C 3 = -40°C to 125°C 5 = -20°C to 85°C 6 = -40°C to 85°C |
X | Packaging | T = Tape&Reel packing |
X | Plating Technology | P, G = ECOPACK® (RoHS compliant) |
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X | Process | Blank A, AB = F8L K = F8H P = F6DP26\\\\% S = F6SP36\\% |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
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MEMprog2 (discontinued) | |
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