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Device: SST32HF32A2 [LFBGA62]

Manufacturer: SST

Part number description for this device:

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SST    
XX Product Series 32 = MPF+PSRAM/SRAM ComboMemory
XF Voltage H = 2.7V to 3.3V
XX Flash Density 16 = 16Mbit
32 = 32Mbit
64 = 64Mbit
X PSRAM/SRAM Density - for devices with PSRAM
A = 16Mbit
B = 32Mbit
- for devices with SRAM
2 = 2Mbit
4 = 4Mbit
8 = 8Mbit
X Hardware Block Protection 1 = Bottom boot block
2 = Top boot block
X Device Blank = PseudoSRAM
C = Standard SRAM
XXX Read Access Speed 70 = 70 ns
X Minimum Endurance 4 = 10000 cycles
X Temperature Range C = Commercial (0°C to 70°C)
E = Extended (-20°C to 85°C)
X Package Type L = LFBGA(8mmx10mmx1.4mm, 0.4mm ball size)
LB = LBGA (10mmx12mmx1.4mm)
XX Package Modifier K = 45 leads or balls
S = 62 ball positions
FS = 63 ball positions
2S = 64 ball positions
X Environmental Attribute E = non-Pb

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0337/0336 (70-0337/0336) = BGA-Bottom-10 (70-0337) + BGA-Top-29 ZIF (70-0336)
BeeHive204AP adapter/module: AP1 BGA-0337/0336 (71-2126)
BeeHive208S adapter/module: BGA-0337/0336 (70-0337/0336) = BGA-Bottom-10 (70-0337) + BGA-Top-29 ZIF (70-0336)
BeeProg2 adapter/module: BGA-0337/0336 (70-0337/0336) = BGA-Bottom-10 (70-0337) + BGA-Top-29 ZIF (70-0336)
BeeProg2AP adapter/module: AP1 BGA-0337/0336 (71-2126)
BeeProg2C adapter/module: BGA-0337/0336 (70-0337/0336) = BGA-Bottom-10 (70-0337) + BGA-Top-29 ZIF (70-0336)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA-0337/0336 (71-2126)
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