Device: R5F11Y68x (ISP)
Manufacturer: Renesas
Part number description for this device:
Move the cursor over the box to highlight particular section| R | Renesas Semiconductor Product | |
| X | Device Type | 5 = MCU |
| X | Memory Type | F = Flash memory |
| XXX | Group | 100 = RL78/G13, Data flash is provided 101 = RL78/G13, Data flash is not provided 102 = RL78/G12, Data flash is provided 103 = RL78/G12, Data flash is not provided 104 = RL78/G14 105 = RL78/G11 107 = RL78/I1A 109 = RL78/F12 110 = RL78/L1C, products with USB 111 = RL78/L1C, products without USB 113 = RL78/F15 10A = RL78/F13 10B = RL78/F13 10C = RL78/D1A 10D = RL78/D1A 10E = RL78/G1A 10J = RL78/G1C, USB host/function controller mounted 10K = RL78/G1C, USB function controller mounted 10P = RL78/F14 10R = RL78/L12 10W = RL78/L13 10Y = RL78/G10 117 = RL78/I1D 11A = RL78/G1D 11B = RL78/G1F 11C = RL78/I1E 11E = RL78/G1D 11F = RL78/G1H 11M = RL78/L1A 11N = RL78/I1C, On-chip AES circuit 11T = RL78/I1C, No on-chip AES circuit 121 = RL78/G16 |
| X | Pin Count | 1 = 10-pin 4 = 16-pin 6 = 20-pin 7 = 24-pin 8 = 25-pin or 20 to 30-pin for RL78/G1A A = 30-pin B = 32-pin C = 36-pin D = 38-pin E = 40-pin F = 44-pin G = 48-pin J = 52-pin L = 64-pin M = 80-pin N = 85-pin P = 100-pin S = 128-pin |
| X | ROM Capacity | 6 = 2KB 7 = 4KB 8 = 8KB 9 = 12KB A = 16KB C = 32KB D = 48KB E = 64KB F = 96KB G = 128KB H = 192KB J = 256KB K = 384KB L = 512KB |
| X | Bonding Wire Material | Blank = Au wire bonding products C = Cu wire bonding products |
| X | Classification | A = Consumer applications, operating ambient temperature -40°C to 85°C D, J = Industrial applications, operating ambient temperature -40°C to 85°C G, L = Industrial applications, operating ambient temperature -40°C to 105°C K, M = Industrial applications, operating ambient temperature -40°C to 125°C Y = Industrial applications, operating ambient temperature -40°C to +150°C |
| XXX | ROM Number | - Omitted with blank product |
| XX | Package Type | BG = FBGA, 0,40mm pitch or TFBGA, 0.50mm pitch FA = LQFP, 0,65mm pitch FB = LQFP, LFQFP, 0,50mm pitch FP = LQFP, 0,80mm pitch LA = LGA, VFLGA, WFLGA, 0,50mm or 0.65mm pitch NA = WQFN, HVQFN, 0.50mm pitch NB = WQFN, HWQFN, 0,40mm pitch SP = SSOP, 0,65mm pitch |
| #XX | Packaging Specification | #30 = Tray (LFQFP) #30 = Tray (LFQFP, LQFP, LSSOP, SSOP), Tube (LSSOP) #50 = Embosed Tape (LFQFP, LQFP, LSSOP, SSOP) #U0 = Tray (VFLGA) #V0 = Tray (SSOP) #W0 = Embossed Tape (VFLGA) #X0 = Embossed Tape (SSOP) |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: Note: via ISP connector Paid ISP support, usage of this device require active 'Credit box' attached to PC |
| BeeHive208S | adapter/module: Note: via ISP connector Paid ISP support, usage of this device require active 'Credit box' attached to PC |
| BeeProg2 | adapter/module: Note: via ISP connector Paid ISP support, usage of this device require active 'Credit box' attached to PC |
| BeeProg2C | adapter/module: Note: via ISP connector Paid ISP support, usage of this device require active 'Credit box' attached to PC |
