Device: M58PR512LE [TFBGA107]
Manufacturer: Numonyx
Part number description for this device:
Move the cursor over the box to highlight particular section| M58 | Device Type | |
| X | Architecture | P = multilevel, multiple bank, large buffer |
| X | Operating Voltage | R = Vdd=1.7V to 2.0V, Vddq=1.7V to 2.0V |
| XXX | Density | 256 = 256Mbit 512 = 512Mbit 001 = 1Gbit |
| X | Technology | L = 65nm technology multilevel design |
| X | Memory Organization | E = Uniform blocks |
| XX | Speed | 96 = 96ns |
| XXX | Package Type | ZAD = Stacked TFBGA105 D stacked footprint ZAC = Stacked TFBGA107 C stacked footprint |
| X | Temperature Range | 5 = -30°C to 85°C |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-0995/0996 (70-0995/0996) = BGA-Bottom-145 (70-0995) + BGA-Top-175 ZIF (70-0996) |
| BeeHive204AP | adapter/module: AP1 BGA-0995/0996 (71-2042) |
| BeeHive208S | adapter/module: BGA-0995/0996 (70-0995/0996) = BGA-Bottom-145 (70-0995) + BGA-Top-175 ZIF (70-0996) |
| BeeProg2 | adapter/module: BGA-0995/0996 (70-0995/0996) = BGA-Bottom-145 (70-0995) + BGA-Top-175 ZIF (70-0996) |
| BeeProg2AP | adapter/module: AP1 BGA-0995/0996 (71-2042) |
| BeeProg2C | adapter/module: BGA-0995/0996 (70-0995/0996) = BGA-Bottom-145 (70-0995) + BGA-Top-175 ZIF (70-0996) |
| BeeHive204AP-AU (discontinued) | adapter/module: AP1 BGA-0995/0996 (71-2042) |
