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Device: M36P0R9060E0 [TFBGA107]

Manufacturer: Numonyx

Part number description for this device:

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M36 Device Type M36 = MultiChip package (Multiple Flash + RAM)
X Flash 1 Architecture A = Single bank, Boot block
L = Multi-Level, Multiple bank, Burst mode
W = Multiple Bank, Burst Mode
C = Single bank, Boot block
P = Multi-level, multi bank, large buffer
X Flash 2 Architecture 0No die
L = Multi-Level, Multiple bank, Burst mode
X Operating Voltage R = Vddf=Vccp=Vddq=1.7 to 1.95V
T = Vddf=1.7 to 2V, Vddq=Vddp=2.7 to 3.3V
W = Vddf=Vccp=2.7V to 3.3V
X Flash 1 Density 5 = 32Mbit
6 = 64Mbit
7 = 128Mbit
8 = 256Mbit
9 = 512Mbit
X Flash 2 Density 0No die
7 = 128Mbit
8 = 256Mbit
X RAM 1 Density 2 = 4Mbit
3 = 8Mbit
4 = 16Mbit
5 = 32Mbit
6 = 64Mbit
X RAM 0 Density 0No die
X Parameter Blocks Location T, U = Top boot block flash
B, L = Bottom boot block flash
D = Mixed (Flash 1 bottom, Flash 2 top)
M = Mixed (Flash 1 top, Flash 2 bottom)
N = Even block flash memory configuration, Mux I/O
E = Even block flash memory configuration
X Product Version Blank
00.13um Flash technology, 70ns speed
00.13um Flash technology, 70ns; 0.18um RAM, 85ns speed
00.13um Flash technology, 70ns; 0.13um RAM, 70ns speed
00.13um Flash technology, 70ns; 0.15um RAM, 70ns speed
00.18um technology PSRAM, 60ns speed
090nm flash technology, 96ns speed, 0.11um PSRAM, 70ns speed
090nm flash technology, 96ns speed, 0.11um PSRAM, 80ns speed
1 = 0.13um Flash technology, 85ns speed; 0.11um PSRAM,
70ns speed, burst mode
1 = 90nm Flash technology, 70ns; 0.13um RAM, 70ns speed
2 = 90nm Flash technology Multilevel Design, 85ns speed;
0.13um RAM, 65ns speed
3 = 90nm Flash technology, 70ns speed, RAM, Mux I/O
4 = 65 nm flash technology, 70ns speed, RAM, 70ns speed, mux I/O
5 = 65nm flash technology, 70ns speed, exteded OTP,
RAM technology: 70ns, mux I/O
8 = 90nm Flash technology Multilevel Design, 85ns speed;
0.11um PSRAM, 70ns speed, burst mode
9 = 65 nm flash technology multilevel design, 70 and 85 ns speed;
0.11 µm PSRAM, 70 ns speed, burst mode
XXX Package Type ZAQ = Stacked TFBGA88/LFBGA88, 8x10mm active ball array, 0.8mm pitch
ZAI = Stacked LFBGA66, 12x8mm - 8x8 active ball array, 0.8mm pitch
ZAC, ZAN = Stacked TFBGA107, C stacked footprint
ZAM = Stacked TFBGA88, 8x10mm, 8x10 active ball array, 0.8mm pitch
ZSP = Stacked TFBGA56, 7x9mm, 56 ball array, 0.8mm pitch
ZS = Stacked TFBGA56, 8x6mm, 10x6 active ball array, 0.50mm pitch
X Option Blank = Standard packing
T = Tape&Reel packing
E = Lead-free and RoHS standard packing
F = Lead-free and RoHS Tape&Reel packing

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0995/0996 (70-0995/0996) = BGA-Bottom-145 (70-0995) + BGA-Top-175 ZIF (70-0996)
BeeHive204AP adapter/module: AP1 BGA-0995/0996 (71-2042)
BeeHive208S adapter/module: BGA-0995/0996 (70-0995/0996) = BGA-Bottom-145 (70-0995) + BGA-Top-175 ZIF (70-0996)
BeeProg2 adapter/module: BGA-0995/0996 (70-0995/0996) = BGA-Bottom-145 (70-0995) + BGA-Top-175 ZIF (70-0996)
BeeProg2AP adapter/module: AP1 BGA-0995/0996 (71-2042)
BeeProg2C adapter/module: BGA-0995/0996 (70-0995/0996) = BGA-Bottom-145 (70-0995) + BGA-Top-175 ZIF (70-0996)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA-0995/0996 (71-2042)
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