Device: SPC5748GxxxxMJ [MAPBGA256]
Manufacturer: NXP
Part number description for this device:
Move the cursor over the box to highlight particular section| X | Qualification Status | P = Engineering samples S = Automotive qualified |
| PC | Power Architecture | |
| XX | Automotive Platform | 57 = Power Architecture in 55nm |
| X | Core Version | 4 = e200z4 core version |
| X | Flash Memory Size | 1 = 1MB 2 = 1.5MB 3 = 2MB 4 = 2.5MB 6 = 3MB 7 = 4MB 8 = 6MB |
| X | Product Version | C = Body control feature set G = Gateway feature set |
| X | Optional Fields | Blank = Feature not available S = HSM (security module) E = Ethernet F = CAN FD B = Both HSM and CAN FD T = HSM and 2nd ethernet G = CAN FD and 2nd ethernet H = HSM, CAN FD and 2nd ethernet |
| XX | Fab and Mask Version Indicator | K = TSMC Fab # = Version of maskset 00N65H 1 = 1N81M 0A = 0N78S |
| X | Package Code | LQ = 144 LQFP KU = 176 LQFP EP MJ = 256 MAPBGA MM = 257 MAPBGA MN = 324 MAPBGA |
| XX | CPU Frequency | 2 = Each z4 operates up to 120MHz 6 = Each z4 operates up to 160MHz |
| X | Shipping Method | Blank = Tray R = Tape and reel |
| X | Temperature Range | C = -40°C to 85°C Ta V = -40°C to 105°C Ta M = -40°C to 125°C Ta |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive304 | adapter/module: AP3 BGA256-3 xPC57-1 (73-5924) |
| BeeProg3 | adapter/module: AP3 BGA256-3 xPC57-1 (73-5924) |
