Device: SPC5744PxxxxMM [MAPBGA257]
Manufacturer: NXP
Part number description for this device:
Move the cursor over the box to highlight particular sectionX | Qualification Status | P = Engineering samples M = Fully spec.qualified, general market flow S = Fully spec.qualified, automotive market flow |
PC | Power Architecture | |
XX | Automotive Platform | 57 = Power Architecture in 55nm |
X | Core Version | 4 = e200z4 core version |
X | Flash Memory Size | 1 = 1MB 2 = 1.5MB 3 = 2MB 4 = 2.5MB 6 = 3MB 7 = 4MB 8 = 6MB |
X | Product Version | P = SafeAssure solution |
X | Optional Fields | Blank = Feature not available E = Ethernet F = FlexRay G = Ethernet + FlexRay |
XX | Fab and Mask Version Indicator | K = TSMC Fab # = Version of maskset 00N65H 1 = 1N81M 0A = 0N78S |
X | Temperature Range | C = -40°C to 85°C V = -40°C to 105°C M = -40°C to 125°C K = -40°C to 135°C for extended temp (+165°C Tj) |
X | Package Code | LQ = 144 LQFP KU = 176 LQFP EP MJ = 256 MAPBGA MM = 257 MAPBGA MN = 324 MAPBGA |
XX | CPU Frequency | 5 = 150MHz 8 = 180MHz 9 = 200MHz |
X | Shipping Method | Blank = Tray R = Tape and reel |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
BeeHive304 | adapter/module: AP3 BGA257-1 xPC57-3 (73-5985) |
BeeProg3 | adapter/module: AP3 BGA257-1 xPC57-3 (73-5985) |