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Device: P87C52UBPN

Manufacturer: NXP

Part number description for this device:

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(P)    
8X Memory Type 0ROMless
5 = Bond-Out(emulation)
3 = ROM
7 = OTP-EPROM
9 = FLASH
C Technology C = 5.0V CMOS
L = 3.0V CMOS
LPC = Low power, Low pin count microcontroller
XXX Device Number  
X Speed Option C = 12 MHz
E = 3.5 MHz to 16 MHz
F = 1.2 MHz to 16 MHz
G = 20 MHz
H = 32 kHz to 12 MHz
I = 24 MHz
P = 40 MHz
S = 0 to 16 MHz
T = 0 to 24 MHz
U = 0 to 33 MHz
X Temperature Range B = Commercial
F = Industrial
H = Military
X Philips Package Code N = Plastic DIP
A = PLCC
B = PQFP
F = Window CerDIP
L = Window CerQuad
Q = Ceramic window QFP
D = SSOP
BD = LQFP
X Philips North America Package Code A = PLCC
B = PQFP
FA = Window CerDIP
KA = Window CerQuad
N = Plastic DIP
LA = Ceramic LCC
DB = SSOP

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204
BeeHive208S
BeeHive304 adapter/module: AP3 DIL48 (73-3319)
BeeProg2
BeeProg2C
BeeProg3 adapter/module: AP3 DIL48 (73-3319)
SmartProg2 (discontinued)
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