Device: LPC3143 [TFBGA180]
Manufacturer: NXP
Part number description for this device:
Move the cursor over the box to highlight particular section| LPC | ||
| X | Device Family | 1 = ARM Cortex-Mx based 2 = ARM7TDMI-S CPU 3 = ARM926EJ 4, 54 = ARM Cortex-M4 based 55 = ARM Cortex-M33 based |
| XXX | Device Number | |
| X | Temperature Range | B = Commercial (0°C to 70°C) F = Industrial (-40°C to 85°C) J = -40°C to 105°C H = Military (-40°C to 125°C) |
| X | Package Code | N = Plastic DIP A = PLCC B = PQFP F = Window CerDIP L = Window CerQuad Q = Ceramic window QFP D = SO DH = TSSOP BD = LQFP HN = HVQFN ET = TFBGA EL = LFBGA HI = HVQFN33 (5x5) |
| X | Number Of Pins | |
| / | ||
| XX | Version | Blank 00 01 |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-1350/1348 (70-1350/1348) = BGA-Bottom-208 (70-1350) + BGA-Top-237 ZIF (70-1348) |
| BeeHive208S | adapter/module: BGA-1350/1348 (70-1350/1348) = BGA-Bottom-208 (70-1350) + BGA-Top-237 ZIF (70-1348) |
| BeeProg2 | adapter/module: BGA-1350/1348 (70-1350/1348) = BGA-Bottom-208 (70-1350) + BGA-Top-237 ZIF (70-1348) |
| BeeProg2C | adapter/module: BGA-1350/1348 (70-1350/1348) = BGA-Bottom-208 (70-1350) + BGA-Top-237 ZIF (70-1348) |
