Device: NW116 [VFBGA63]
Manufacturer: Micron
Part number description for this device:
Move the cursor over the box to highlight particular section| MT | Micron Technology | |
| XXX | Product Family | 29F = Single-supply NAND flash memory 29H = High speed NAND flash |
| XX | Density | 1G = 1Gbit 2G = 2Gbit 4G = 4Gbit 8G = 8Gbit 16G = 16Gbit 32G = 32Gbit 64G = 64Gbit 128G = 128Gbit 256G = 256Gbit |
| XX | Device Width | 08 = 8 bits 16 = 16 bits |
| X | Classification | A = SLC, 1 die, 1 nCE, 1 RnB, 1 I/O channel B = SLC, 2 dies, 1 nCE, 1 RnB, 1 I/O channel C = SLC, 2 dies, 2 nCE, 1 RnB, 1 I/O channel D = SLC, 2 dies, 2 nCE, 2 RnB, 1 I/O channel E = SLC, 2 dies, 2 nCE, 2 RnB, 2 I/O channels F = SLC, 4 dies, 2 nCE, 2 RnB, 1 I/O channel G = SLC, 4 dies, 2 nCE, 2 RnB, 2 I/O channels J = SLC, 4+4 dies, 2+2 nCE, 2+2 RnB, 1 I/O channel K = SLC, 8 dies, 4 nCE, 4 RnB, 2 I/O channels Z = SLC, 1 die, n.a. nCE, n.a. RnB, 1 I/O channel M = MLC, 1 die, 1 nCE, 1 RnB, 1 I/O channel N = MLC, 2 dies, 1 nCE, 1 RnB, 1 I/O channel P = MLC, 2 dies, 2 nCE, 1 RnB, 1 I/O channel Q = MLC, 2 dies, 2 nCE, 2 RnB, 1 I/O channel R = MLC, 2 dies, 2 nCE, 2 RnB, 2 I/O channels T = MLC, 4 dies, 2 nCE, 2 RnB, 1 I/O channel U = MLC, 4 dies, 2 nCE, 2 RnB, 2 I/O channels V = MLC, 4+4 dies, 2+2 nCE, 2+2 RnB, 1 I/O channel W = MLC, 8 dies, 4 nCE, 4 RnB, 2 I/O channels Y = MLC, 8 dies, 4 nCE, 4 RnB, 1 I/O channel |
| X | Operating Voltage Range | A = 3.3V (2.70V to 3.60V), VccQ 3.3V (2.70V to 3.60V) B = 1.8V (1.70V to 1.95V) C = 3.3V (2.70V to 3.60V), VccQ 1.8V (1.70V to 1.95V) |
| X | Generation | A = 1st generation B = 2nd generation C = 3rd generation D = 4th generation etc. |
| XX | Package Type | WC = 48-pin TSOP I (OCPL version) (Pb-free) WP = 48-pin TSOP I (CPL version) (Pb-free) HC = 63-ball VFBGA, 10.5x13x1.0 H1 = 100-ball VFBGA (Pb-free), 12x18x1.0 H2 = 100-ball TFBGA (Pb-free), 12x18x1.2 C2 = 52-pad ULGA, 12x17x0.4 C3 = 52-pad ULGA, 12x17x0.65 C4 = 52-pad VLGA, 12x17x1.0 C5 = 52-pad VLGA, 14x18x1.0 C6 = 52-pad LLGA, 14x18x1.47 C7 = 48-pad LLGA, 12x20x1,47 SWC = 48-pin Stacked TSOP (OCPL version) (Pb-free) SWP = 48-pin Stacked TSOP (CPL version) (Pb-free) |
| XX | Speed Grade (MT29H only) | 15 = 133 MT/s 12 = 166 MT/s |
| XX | Flash Performance | Blank = Full spec |
| XX | Block Option | Blank = Standard device |
| XX | Temperature Range | Blank = Commercial (0°C to 70°C) ET = Extended (-40°C to 85°C) WT = Wireless (-25°C to 85°C) |
| XX | Production Status | Blank = Production ES = Engineering samples MS = Mechanical samples QS = Qualification samples |
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| X | Device Revision | A = 1st design revision B = 2nd design revision etc. |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-1008/1023 (70-1008/1023) = OR BGA-Bottom-148 (70-1008) OR BGA-Top-196 ZIF-CS (70-1023) OR BGA-2362/2361 (70-2362/2361) OR BGA-Bottom-257 (70-2362) OR BGA-Top-265 ZIF (70-2361) |
| BeeHive208S | adapter/module: BGA-1008/1023 (70-1008/1023) = OR BGA-Bottom-148 (70-1008) OR BGA-Top-196 ZIF-CS (70-1023) OR BGA-2362/2361 (70-2362/2361) OR BGA-Bottom-257 (70-2362) OR BGA-Top-265 ZIF (70-2361) |
| BeeProg2 | adapter/module: BGA-1008/1023 (70-1008/1023) = OR BGA-Bottom-148 (70-1008) OR BGA-Top-196 ZIF-CS (70-1023) OR BGA-2362/2361 (70-2362/2361) OR BGA-Bottom-257 (70-2362) OR BGA-Top-265 ZIF (70-2361) |
| BeeProg2C | adapter/module: BGA-1008/1023 (70-1008/1023) = OR BGA-Bottom-148 (70-1008) OR BGA-Top-196 ZIF-CS (70-1023) OR BGA-2362/2361 (70-2362/2361) OR BGA-Bottom-257 (70-2362) OR BGA-Top-265 ZIF (70-2361) |
