Device: N25Q128A31E [SO8W] (Quad I/O)
Manufacturer: Micron
Part number description for this device:
Move the cursor over the box to highlight particular section| XXX | Device Type | N25Q = Serial Flash memory, QuadI/O, XiP N25W = Wireless Serial NOR Flash memory, Quad I/O, XIP |
| XXX | Device Density | 016 = 16Mbit 032 = 32Mbit 064 = 64Mbit 128 = 128Mbit 256 = 256Mbit 512 = 512Mbit 00A = 1Gbit |
| X | Technology | A = 65nm |
| X | Feature Set | 1 = Byte addressability, Hold pin, Micron XiP 2 = Byte addressability, Hold pin, Basic XiP 3 = Byte addressability, Reset pin, Micron XiP 4 = Byte addressability, Reset pin, Basic XiP 7 = Byte addressability; Hold pin; Micron XIP (4-byte addressing mode is the default at power-up.) 8 = Byte addressability; Hold pin; Micron XIP, RESET pin |
| X | Operating Voltage | 1 = Vcc=1.7V to 2.0V 3 = Vcc=2.7V to 3.6V |
| X | Block Structure | B = Bottom T = Top E = Uniform (no boot sectors) G = Uniform (64KB and 4KB) , easy transparent stack |
| XX | Package Type | F4 = U-PDFN-8 4mm x 3mm (MLP8) F6 = V-PDFN-8 6mm x 5mm (MLP8 6mm x 5mm) F7 = V-PDFN-8 6mm x 5mm Sawn (MLP8 6mm x 5mm) F8 = V-PDFN-8 8mm x 6mm (MLP8 8mm x 6mm) 12 = T-PBGA-24b05 6mm x 8mm 14 = T-PBGA-24b05 6mm x 8mm, 4x6 ball array SC = SOP2-8 150 mils body width (SO8N) SE = SOP2-8 208 mils body width (SO8W) SF = SOP2-16 300 mils body width (SO16W) 51 = XF-SCSP-8/2mm x 2.8mm (XFCSP) 53 = XF-SCSP-8/2.93mm x 3.5mm (XFCSP) |
| X | Temperature And Test Flow | 4 = Industrial temperature range, –40°C to 85°C, device tested with standard test flow A = Automotive temperature range, –40°C to 125°C, device tested with high reliability certified test flow H = Industrial temperature range, –40°C to 85°C, device tested with high reliability certified test flow 4 = Industrial, Wireless temperature range, –25 to 85°C, device tested with standard test flow |
| X | Security Features | 0No extra security |
| X | Packing Options | E = Tray packing F = Tape and reel packing G = Tube packing |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive304 | adapter/module: AP3 SOIC8-200 SFlash-1 (73-3158) |
| BeeProg3 | adapter/module: AP3 SOIC8-200 SFlash-1 (73-3158) |
