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Device: N25Q064A13E [SO8W]

Manufacturer: Micron

Part number description for this device:

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XXX Device Type N25Q = Serial Flash memory, QuadI/O, XiP
N25W = Wireless Serial NOR Flash memory, Quad I/O, XIP
XXX Device Density 016 = 16Mbit
032 = 32Mbit
064 = 64Mbit
128 = 128Mbit
256 = 256Mbit
512 = 512Mbit
00A = 1Gbit
X Technology A = 65nm
X Feature Set 1 = Byte addressability, Hold pin, Micron XiP
2 = Byte addressability, Hold pin, Basic XiP
3 = Byte addressability, Reset pin, Micron XiP
4 = Byte addressability, Reset pin, Basic XiP
7 = Byte addressability; Hold pin; Micron XIP
(4-byte addressing mode is the default at power-up.)
8 = Byte addressability; Hold pin; Micron XIP, RESET pin
X Operating Voltage 1 = Vcc=1.7V to 2.0V
3 = Vcc=2.7V to 3.6V
X Block Structure B = Bottom
T = Top
E = Uniform (no boot sectors)
G = Uniform (64KB and 4KB) , easy transparent stack
XX Package Type F4 = U-PDFN-8 4mm x 3mm (MLP8)
F6 = V-PDFN-8 6mm x 5mm (MLP8 6mm x 5mm)
F7 = V-PDFN-8 6mm x 5mm Sawn (MLP8 6mm x 5mm)
F8 = V-PDFN-8 8mm x 6mm (MLP8 8mm x 6mm)
12 = T-PBGA-24b05 6mm x 8mm
14 = T-PBGA-24b05 6mm x 8mm, 4x6 ball array
SC = SOP2-8 150 mils body width (SO8N)
SE = SOP2-8 208 mils body width (SO8W)
SF = SOP2-16 300 mils body width (SO16W)
51 = XF-SCSP-8/2mm x 2.8mm (XFCSP)
53 = XF-SCSP-8/2.93mm x 3.5mm (XFCSP)
X Temperature And Test Flow 4 = Industrial temperature range, –40°C to 85°C,
device tested with standard test flow
A = Automotive temperature range, –40°C to 125°C,
device tested with high reliability certified test flow
H = Industrial temperature range, –40°C to 85°C,
device tested with high reliability certified test flow
4 = Industrial, Wireless temperature range, –25 to 85°C,
device tested with standard test flow
X Security Features 0No extra security
X Packing Options E = Tray packing
F = Tape and reel packing
G = Tube packing

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL8W/SOIC8 ZIF 200mil SFlash-1b (70-5486) OR DIL8W/SOIC8 ZIF 200mil SFlash-1a (70-1270A)
BeeHive204AP adapter/module: AP1 SOIC8 ZIF 200mil SFlash-1a (71-3093)
BeeHive208S adapter/module: DIL8W/SOIC8 ZIF 200mil SFlash-1b (70-5486) OR DIL8W/SOIC8 ZIF 200mil SFlash-1a (70-1270A)
BeeHive304 adapter/module: AP3 SOIC8-200 SFlash-1 (73-3158)
BeeProg2 adapter/module: DIL8W/SOIC8 ZIF 200mil SFlash-1b (70-5486) OR DIL8W/SOIC8 ZIF 200mil SFlash-1a (70-1270A)
BeeProg2AP adapter/module: AP1 SOIC8 ZIF 200mil SFlash-1a (71-3093)
BeeProg2C adapter/module: DIL8W/SOIC8 ZIF 200mil SFlash-1b (70-5486) OR DIL8W/SOIC8 ZIF 200mil SFlash-1a (70-1270A)
BeeProg3 adapter/module: AP3 SOIC8-200 SFlash-1 (73-3158)
BeeHive204AP-AU (discontinued) adapter/module: AP1 SOIC8 ZIF 200mil SFlash-1a (71-3093)
MEMprog2 (discontinued) adapter/module: DIL8W/SOIC8 ZIF 200mil (70-0909)
SmartProg2 (discontinued) adapter/module: DIL8W/SOIC8 ZIF 200mil (70-0909)
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