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Device: MT29F1G16ABCHC [VFBGA63]

Manufacturer: Micron

Part number description for this device:

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MT Micron Technology  
XXX Product Family 29F = Single-supply NAND flash memory
29H = High speed NAND flash
XX Density 1G = 1Gbit
2G = 2Gbit
4G = 4Gbit
8G = 8Gbit
16G = 16Gbit
32G = 32Gbit
64G = 64Gbit
128G = 128Gbit
256G = 256Gbit
XX Device Width 08 = 8 bits
16 = 16 bits
X Classification A = SLC, 1 die, 1 nCE, 1 RnB, 1 I/O channel
B = SLC, 2 dies, 1 nCE, 1 RnB, 1 I/O channel
C = SLC, 2 dies, 2 nCE, 1 RnB, 1 I/O channel
D = SLC, 2 dies, 2 nCE, 2 RnB, 1 I/O channel
E = SLC, 2 dies, 2 nCE, 2 RnB, 2 I/O channels
F = SLC, 4 dies, 2 nCE, 2 RnB, 1 I/O channel
G = SLC, 4 dies, 2 nCE, 2 RnB, 2 I/O channels
J = SLC, 4+4 dies, 2+2 nCE, 2+2 RnB, 1 I/O channel
K = SLC, 8 dies, 4 nCE, 4 RnB, 2 I/O channels
Z = SLC, 1 die, n.a. nCE, n.a. RnB, 1 I/O channel
M = MLC, 1 die, 1 nCE, 1 RnB, 1 I/O channel
N = MLC, 2 dies, 1 nCE, 1 RnB, 1 I/O channel
P = MLC, 2 dies, 2 nCE, 1 RnB, 1 I/O channel
Q = MLC, 2 dies, 2 nCE, 2 RnB, 1 I/O channel
R = MLC, 2 dies, 2 nCE, 2 RnB, 2 I/O channels
T = MLC, 4 dies, 2 nCE, 2 RnB, 1 I/O channel
U = MLC, 4 dies, 2 nCE, 2 RnB, 2 I/O channels
V = MLC, 4+4 dies, 2+2 nCE, 2+2 RnB, 1 I/O channel
W = MLC, 8 dies, 4 nCE, 4 RnB, 2 I/O channels
Y = MLC, 8 dies, 4 nCE, 4 RnB, 1 I/O channel
X Operating Voltage Range A = 3.3V (2.70V to 3.60V), VccQ 3.3V (2.70V to 3.60V)
B = 1.8V (1.70V to 1.95V)
C = 3.3V (2.70V to 3.60V), VccQ 1.8V (1.70V to 1.95V)
X Generation A = 1st generation
B = 2nd generation
C = 3rd generation
D = 4th generation
etc.
XX Package Type WC = 48-pin TSOP I (OCPL version) (Pb-free)
WP = 48-pin TSOP I (CPL version) (Pb-free)
HC = 63-ball VFBGA, 10.5x13x1.0
H1 = 100-ball VFBGA (Pb-free), 12x18x1.0
H2 = 100-ball TFBGA (Pb-free), 12x18x1.2
C2 = 52-pad ULGA, 12x17x0.4
C3 = 52-pad ULGA, 12x17x0.65
C4 = 52-pad VLGA, 12x17x1.0
C5 = 52-pad VLGA, 14x18x1.0
C6 = 52-pad LLGA, 14x18x1.47
C7 = 48-pad LLGA, 12x20x1,47
SWC = 48-pin Stacked TSOP (OCPL version) (Pb-free)
SWP = 48-pin Stacked TSOP (CPL version) (Pb-free)
XX Speed Grade (MT29H only) 15 = 133 MT/s
12 = 166 MT/s
XX Flash Performance Blank = Full spec
XX Block Option Blank = Standard device
XX Temperature Range Blank = Commercial (0°C to 70°C)
ET = Extended (-40°C to 85°C)
WT = Wireless (-25°C to 85°C)
XX Production Status Blank = Production
ES = Engineering samples
MS = Mechanical samples
QS = Qualification samples
:    
X Device Revision A = 1st design revision
B = 2nd design revision
etc.

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-1008/1023 (70-1008/1023) = OR BGA-Bottom-148 (70-1008) OR BGA-Top-196 ZIF-CS (70-1023) OR BGA-2362/2361 (70-2362/2361) OR BGA-Bottom-257 (70-2362) OR BGA-Top-265 ZIF (70-2361)
BeeHive208S adapter/module: BGA-1008/1023 (70-1008/1023) = OR BGA-Bottom-148 (70-1008) OR BGA-Top-196 ZIF-CS (70-1023) OR BGA-2362/2361 (70-2362/2361) OR BGA-Bottom-257 (70-2362) OR BGA-Top-265 ZIF (70-2361)
BeeHive304 adapter/module: AP3 BGA63-2.12 NAND-1 (73-3167)
BeeProg2 adapter/module: BGA-1008/1023 (70-1008/1023) = OR BGA-Bottom-148 (70-1008) OR BGA-Top-196 ZIF-CS (70-1023) OR BGA-2362/2361 (70-2362/2361) OR BGA-Bottom-257 (70-2362) OR BGA-Top-265 ZIF (70-2361)
BeeProg2C adapter/module: BGA-1008/1023 (70-1008/1023) = OR BGA-Bottom-148 (70-1008) OR BGA-Top-196 ZIF-CS (70-1023) OR BGA-2362/2361 (70-2362/2361) OR BGA-Bottom-257 (70-2362) OR BGA-Top-265 ZIF (70-2361)
BeeProg3 adapter/module: AP3 BGA63-2.12 NAND-1 (73-3167)
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