Device: MT29F16G08ABCCBH1-10 [VBGA100]
Manufacturer: Micron
Part number description for this device:
Move the cursor over the box to highlight particular section| MT | Micron Technology | |
| XXX | Product Family | 29F = Single-supply NAND flash 29E = Enterprise NAND flash 29H = High-speed NAND flash |
| XX | Density | 1G = 1Gbit 2G = 2Gbit 4G = 4Gbit 8G = 8Gbit 16G = 16Gbit 32G = 32Gbit 64G = 64Gbit 128G = 128Gbit 256G = 256Gbit 512G = 512Gbit 1T = 1Tbit 2T = 2Tbit 4T = 4Tbit |
| XX | Device Width | 01 = 1bit 08 = 8 bits 16 = 16bits |
| X | Level | A = SLC B = Reserved C = MLC-2 E = TLC |
| X | Classification | A = 1 die, 0 nCE, 0 RnB, 1 I/O channel B = 1 die, 1 nCE, 0 RnB, 1 I/O channel D = 2 dies, 1 nCE, 1RnB, 1 I/O channel E = 2 dies, 2 nCE, 2 RnB, 2 I/O channels F = 2 dies, 2 nCE, 2 RnB, 1 I/O channel G = 3 dies, 3 nCE, 3 RnB, 3 I/O channels J = 4 dies, 2 nCE, 2 RnB, 1 I/O channel K = 4 dies, 2 nCE, 2 RnB, 2 I/O channels L = 4 dies, 4 nCE, 4 RnB, 4 I/O channel M = 4 dies, 4 nCE, 4 RnB, 2 I/O channels Q = 8 dies, 4 nCE, 4 RnB, 4 I/O channel R = 8 dies, 2 nCE, 2 RnB, 2 I/O channels T = 16 dies, 8 nCE, 4 RnB, 2 I/O channel U = 8 dies, 4 nCE, 4 RnB, 2 I/O channels V = 16 dies, 8 nCE, 4RnB, 4 I/O channels |
| X | Operating Voltage Range | A = Vcc: 3.3V (2.70V to 3.60V), Vccq: 3.3V (2.70V to 3.60V) B = Vcc: 1.8V (1.70V to 1.95V), Vccq: 1.8V (1.70V to 1.95V) C = Vcc: 3.3V (2.70V to 3.60V), Vccq: 1.8V (1.70V to 1.95V) E = Vcc: 3.3V (2.70V to 3.60V), Vccq: 3.3V (2.70V to 3.60V) or 1.8V (1.70V to 1.95V) F = Vcc: 3.3V (2.50V to 3.60V), Vccq: 1.2V (1.14V to 1.26V) G = Vcc: 3.3V (2.60V to 3.60V), Vccq: 1.8V (1.70V to 1.95V) H = Vcc: 3.3V (2.50V to 3.60V), Vccq: 1.2V (1.14V to 1.26V) or 1.8V (1.70V to 1.95V) J = Vcc: 3.3V (2.50V to 3.60V), Vccq: 1.8V (1.70V to 1.95V) K = Vcc: 3.3V (2.60V to 3.60V), Vccq: 3.3V (2.60V to 3.60V) L = Vcc: 3.3V (2.60V to 3.60V), Vccq: 3.3V (2.60V to 3.60V) or 1.8V (1.70V to 1.95V) |
| X | Generation Feature Set | A = 1-st set of device features B = 2-nd set of device features (only if different than 1-st set) C = 3-rd set of device features (only if different) D = 4-th set of device features (only if different) etc. |
| X | Interface | A = Asynchronous only B = Synchronous/Asynchronous C = Synchronous only D = SPI |
| XX | Package Code | SF = 16-pin SOP, 300mils WP = 48-pin TSOP I (CPL version, Pb-free) WC = 48-pin TSOP I (OCPL version, Pb-free) WB = 8-pin U-PDFN, 6x8x0.65 C3 = 52-pad ULGA, 12x17x0.65 C4 = 52-pad VLGA, 12x17x1.0(SDP/DDP/QDP) C5 = 52-pad VLGA, 14x18x1.0(SDP/DDP/QDP) C6 = 52-pad LLGA, 14x18x1.47(DDP/QDP/8DP) C7 = 48-pad LLGA, 12x20x1.47(8DP) C8 = 52-pad WLGA, 14x18x0.75(DDP/QDP) G1 = 272-ball VBGA, 14x18x1.0 (SDP, DDP, 3DP, QDP) G2 = 272-ball VBGA, 14x18x1.3 (QDP, 8DP) G6 = 272-ball VBGA, 14x18x1.5 (16DP) H1 = 100-ball VBGA (Pb-free), 12x18x1.0 H2 = 100-ball TBGA (Pb-free), 12x18x1.2 H3 = 100-ball LBGA (Pb-free), 12x18x1.4 (DDP/QDP/8DP) H4 = 63-ball VFBGA, 9x11x1 HC = 63-ball VFBGA, 10.5x13x1.0 H6 = 152-ball VBGA, 14x18x1.0 (SDP, DDP) H7 = 152-ball TBGA, 14x18x1.2 (QDP) H8 = 152-ball LBGA, 14x18x1.4 (8DP) H9 = 100-ball LBGA, 12x18x1.6 (16DP) J1 = 132-ball VBGA, 12x18x1.0 (SDP, DDP) J2 = 132-ball TBGA, 12x18x1.2 (QDP) J3 = 132-ball LBGA, 12x18x1.4 (8DP) J4 = 132-ball VBGA, 12x18x1.0 (SDP, DDP) J5 = 132-ball TBGA, 12x18x1.2 (QDP) J6 = 132-ball LBGA, 12x18x1.4 (8DP) J7 = 152-ball LBGA, 14x18x1.5 (16DP) J9 = 132-ball LBGA, 12x18x1.5 (16DP) 12 = 24-ball T-PBGA, 6x8x1.5 |
| XX | Speed Grade (Synchronous) | Blank = Asynchronous only 20 = 100MT/s 15 = 133MT/s 12 = 166MT/s 10 = 200MT/s 6 = 333MT/s 5 = 400MT/s 4 = 533MT/s 3 = 667MT/s |
| XX | Temperature Range | Blank = Commercial (0°C to 70°C) AAT = Automotive Industrial (-40°C to 105°C) AIT = Automotive Industrial (-40°C to 85°C) IT = Extended (-40°C to 85°C) WT = Wirelles (-25°C to 85°C) |
| X | Special Options | E = Error correction with internal ECC enabled M = Media R = MLC+Features X = Premium lifecycle product (PLP) S = Security features Z = Polyimide (if applicable) |
| XX | Production Status | Blank = Production ES = Engineering samples QS = Qualification samples MS = Mechanical samples |
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| X | Design Revision (Shrink) | A = 1-st design revision B = 2-nd design revision etc. |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-2331/2330 (70-2331/2330) = BGA-Bottom-249 (70-2331) + BGA-Top-263 ZIF-CS (70-2330) |
| BeeHive208S | adapter/module: BGA-2331/2330 (70-2331/2330) = BGA-Bottom-249 (70-2331) + BGA-Top-263 ZIF-CS (70-2330) |
| BeeHive304 | adapter/module: AP3 BGA100-9 NAND-1 (73-5242) |
| BeeProg2 | adapter/module: BGA-2331/2330 (70-2331/2330) = BGA-Bottom-249 (70-2331) + BGA-Top-263 ZIF-CS (70-2330) |
| BeeProg2C | adapter/module: BGA-2331/2330 (70-2331/2330) = BGA-Bottom-249 (70-2331) + BGA-Top-263 ZIF-CS (70-2330) |
| BeeProg3 | adapter/module: AP3 BGA100-9 NAND-1 (73-5242) |
