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Device: M29W400FTxxZA [TFBGA48]

Manufacturer: Micron

Part number description for this device:

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M    
XX Family Descriptor 28 = FLASH
29 = Single Supply Flash memory
29K = LightFlash
50 = Flash memory for PC BIOS
29D, 59D = Dual Bank Flash
X Operating Voltage F = 5V
W = 2.7 to 3.6V
R = 1.8V
V = Low-voltage
FLW = Firmware Hub/Low pin count interface, Vcc=2.7 to 3.6V
LPW = Low pin count interface, Vcc=2.7 to 3.6V
XXX Density 101 = 128kx8
102 = 64kx16
151 = 192kx8
160, 160B, 160C, 160EC, 160ES. 160FS = 1Mx16
161 = 2Mx8
201 = 256kx8
210 = 2Mx8
220 = 2Mx16
256, 256A = 32kx8
320B, 320C, 320EB, 320EC, 032E = 2Mx16
323D, 324D = 4Mx8 / 2Mx16
410, 430, 440 = 512kx8 / 256kx16
411, 421 = 512kx8
420 = 256kx16
512 = 64kx8
640C, 640F, 640EC, 640FC = 4Mx16
841 = 1Mx8
800B, 800C = 512kx16
X Boot Block Architecture A, T = Top Boot Block
B = Bottom Boot Block
XX Speed Option 70 = 70 ns
80 = 80 ns
90 = 90 ns
100 = 100 ns
120 = 120 ns
X Power Supplies Blank = Vcc +/-10\\\\%, Vpp +/-5\\\\%
X = Vcc +/-5\\%, Vpp +/-5\\%
Y = Vcc +/-10\%, Vpp +/-10\%
X Package Type N = TSOP40, TSOP48
P = Plastic DIP
K = PLCC
ZB = TFBGA
M = PSOP
B = Plastic DIP32
C = PLCC32
NZ = TSOP32
ZE, ZF = TFBGA
X Temperature Range 0, 1 = 0°C to 70°C
3 = -40°C to 125°C
5 = -20°C to 85°C
6 = -40°C to 85°C
XX Option T, S = Tape&Reel
R = Reverse pinout

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive304 adapter/module: AP3 BGA48-1.01 NOR-4 (73-4302)
BeeProg3 adapter/module: AP3 BGA48-1.01 NOR-4 (73-4302)
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