Device: JY177 [TFBGA137]
Manufacturer: Micron
Part number description for this device:
Move the cursor over the box to highlight particular section| MT | Micron Technology | |
| XXX | Product Family | 27C = OneNAND + LPDRAM MCP/PoP 28C = NOR + LPDRAM MCP/PoP 29C = NAND flash + LPDRAM MCP/PoP |
| XX | NAND Flash Density | DM = 128Mbit EM = 256Mbit FM = 512Mbit 1G = 1Gbit 2G = 2Gbit 4G = 4Gbit 8G = 8Gbit AG = 16Gbit BG = 32Gbit CG = 64Gbit DG = 128Gbit |
| XXX | LPDRAM Density | 56M = 256Mbit 12M = 512Mbit 40M = 640Mbit 24M = 1Gbit 52M = 1152Mbit 48M = 2Gbit 72M = 3Gbit 96M = 4Gbit 92M = 8Gbit |
| X | Operating Voltage Range | A = 1.70V to 1.95V B = 1.65V to 1.90V C = 1.50V to 1.70V D = 1.20V to 1.50V F = 1.00V to 1.20V G = 1.70 – 1.95V DRAM; 2.70 – 3.60V NOR Vcc; 1.65 – 3.60V Vccq |
| X | NAND Flash Configuration | A = x8, M28A B = x16, M28A C = x8, M48A D = x16, M48A E = x8, L58A F = x16, L58A G = x8, M49A H = x16, M49A J = x8, M59A K = x16, M59A L = x8, L59A M = x16, L59A N = x8, M50A P = x16, M50A R = x8, L51A T = x16, L51A U = x8, M58A V = x16, M58A Y = x8 M60A Z = x16, M60A AA = x8, M69A AB = x16, M69A AC = x8, M68A AD = x16, M68A AE = x8, M71M AF = x16, M71M AG = x8, M70M AH = x16, M70M AI = x8, M68M AJ = x8, M68M AL = x16, M61N AH = x16 QKHP AM = x16, M69N AK = x16, 3F0S |
| X | LPDRAM Configuration | A = DDR, T37M x16 B = SDR, Y37M x16 C = DDR, T37M x32 D = SDR, Y37M x32 J = DDR, T48M x16 K = SDR, Y48M x16 L = DDR, T48M x32 M = SDR, Y48M x32 N = DDR, T47M x16 P = SDR, Y47M x16 R = DDR, T47M x32 T = SDR, Y47M x32 V = DDR, T67M x16 Y = DDR, T67M x32 Z = SDR, Y36N x16 AA = DDR, T36N x16 AB = DDR, T35M x32 AC = SDR, Y35M x32 AE = SDR, Y67M x16 AF = SDR, Y67M, x32 AG = SDR, Y67M x16 + Y35M x16 AH = DDR, T68M x16 AJ = SDR, Y68M x16 AK = DDR, T68M x32 AL = SDR, Y68M x32 AM = DDR, T69M x16 AN = SDR, Y69M x16 AP = DDR, T69M x32 AR = SDR, Y69M x32 AS = SDR, Y47M x16(2) + Y35M x16 AT = DDR, T48M x16(2) + T48M x32 AU = DDR, T36N x32 AV = DDR, T36N x32 AY = DDR, T69M x32 + T68M x32 AZ = DDR, T79M x16 BA = DDR, T79M x32 BB = DDR, T89M x32 |
| X | Chip Count | A = 1 NAND, 1 LPDRAM (1xCE#, 1xCS#) B = 2 NAND, 1 LPDRAM (2xCE#, 1xCS#) C = 1 NAND, 2 LPDRAM (1xCE# 2xCS#) D = 2 NAND, 2 LPDRAM (2xCE#, 2xCS#) E = 1 NAND, 3 LPDRAM (1xCE#, 2xCS#) F = 2 NAND, 3 LPDRAM (1xCE#, 2xCS#) G = 1 NAND, 4 LPDRAM (1xCE#, 2xCS#) H = 1 NAND, 3 LPDRAM (1xCE#, 3xCS#) |
| XX | Package Code | CA = 152-ball PoP VFBGA (14.0x14.0x0.9mm) CG = 152-ball PoP VFBGA (14.0x14.0x1.0mm) HC = 149-ball TFBGA (16.5x10.5x1.2mm) JA = 137-ball TFBGA (13.0x10.5x1.2mm) JC = 107-ball TFBGA (13.0x10.2x1.2mm) JG = 168-ball PoP VFBGA (12.0x12.0x0.9mm) JI = 168-ball PoP TFBGA (12.0x12.0x1.1mm) JQ = 152-ball PoP TFBGA (14.0x14.0x1.1mm) JR = 137-ball LFBGA (13x10.5x1.4mm) JS = 137-ball TFBGA (13x10.5x1.4mm) JV = 168-ball PoP VFBGA (12.0x12.0x1.0mm) KC = 107-ball TFBGA (13x10.5x1.1mm) KD = 137-ball TFBGA (13.0x10.5x1.1 mm) KN = 184-ball PoP VFBGA (14.0x14.0x1.0mm) KQ = 168-ball PoP WFBGA (12.0x12.0x0.75mm) KS = 137-ball VFBGA (13.0x10.5x1.0mm) MA = 168-ball PoP WFBGA (12.0x12.0x0.7mm) MC = 240-ball PoP WFBGA (14.0x14.0x0.8mm) MD = 130-ball VFBGA (9.0x8.0x1.0mm) ME = 240-ball PoP TFBGA (14.0x14.0x1.12mm) MF = 168-ball PoP VFBGA (12.0x12.0x0.85mm) MJ = 240-ball PoP VFBGA (14.0x14.0x0.85mm) MK = 153-ball VFBGA (12.0x10.0x0.9mm) ML = 153-ball VFBGA (9.0x8.0x0.9mm) MS = 191-ball PoP WFBGA (12.0x12.0x0.8mm) NE = 133-ball VFBGA (11.0x10.0x1.0mm) RN = 160-ball FBGA (11.5x11.5x0.94mm) TE = 153-ball VFBGA (12.0x10.0x1.0mm) PL = 162-ball WFBGA (13.0x11.5x0.8mm) SK = 162-ball VFBGA (13.0x11.5x0.9mm) SP = 192-ball WFBGA (10.5x8.0x0.8mm) |
| X | LPDRAM Access Time | 5 = 200MHz, CL3 54 = 185MHz, CL3 6 = 166MHz, CL3 75 = 133MHz, CL3 8 = 125MHz, CL3 10 = 100MHz 48 = 208MHz |
| X | Special Options | Blank = Standard L = Low-power option E = On-die ECC enabled |
| XX | Operating Temperature Range | IT = Industrial (-40°C to 85°C) W = Wireless (-25°C to 85°C) |
| XX | Production Status | Blank = Production ES = Engineering sample MS = Mechanical sample QS = Qualification sample DC = Daisy chain |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: DIL48/BGA137-1 ZIF NAND-1 (70-3113) |
| BeeHive208S | adapter/module: DIL48/BGA137-1 ZIF NAND-1 (70-3113) |
| BeeProg2 | adapter/module: DIL48/BGA137-1 ZIF NAND-1 (70-3113) |
| BeeProg2C | adapter/module: DIL48/BGA137-1 ZIF NAND-1 (70-3113) |
