Device: JW777 [WFBGA153]
Manufacturer: Micron
Part number description for this device:
Move the cursor over the box to highlight particular section| MT | Micron Technology | |
| XX | Product Family | FC = NAND flash + controller |
| XX | NAND Flash Density | 1G = 1GB 2G = 2GB 4G = 4GB 8G = 8GB 16G = 16GB 32G = 32GB 64G = 64GB |
| X | NAND Flash Component | C = Configuration: MLC 8Gbx8, 3.3V / Generation: A D = Configuration: MLC 8Gbx8, 3.3V / Generation: B E = Configuration: MLC 16Gbx8, 3.3V / Generation: A G = Configuration: MLC 16Gbx8, 3.3V / Generation: A K = Configuration: MLC 32Gbx8, 3.3V / Generation: B M = MLC 16Gb, x8, 3.3V (25nm) L = MLC 32Gb, x8, 3.3V (25nm) J = MLC 64Gb, x8, 3.3V (25nm) |
| X | Controller Revision | F = 6 K = 11 L = 12 Q T V |
| X | - reserved blank | |
| XX | Package Codes | DI = 169-ball TFBGA 12x16x1.2mm DK = 169-ball LFBGA 12x16x1.4mm DQ = 100-ball LBGA 14x18x1.4mm DM = 153-ball FBGA, 11.5mm x 13mm x 1.2mm DN = 169-ball FBGA, 14mm x 18mm x 1.4mm DL = 169-ball FBGA, 12mm x 18mm x 1.2mm EA = 153 WFBGA 11.5mm x 13mm x 0.8mm EC = 169 WFBGA 14mm x 18mm x 0.8mm ED = 169 VFBGA 14mm x 18mm x 1.0mm |
| XX | Operating Temperature Range | Blank = 0°C to 70°C WT = Standard (-30°C to 85°C) IT = Industrial (–40°C to +85°C) |
| XX | Production Status | Blank = Production ES = Engineering sample QS = Qualification sample MS = Mechanical sample |
| : | ||
| X | Design Revision | Blank = N/A A = Design revision A |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-276 ZIF-CS (a) (70-2554A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-276 ZIF-CS (a) (70-2554A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331) |
| BeeHive204AP | adapter/module: AP1 BGA153-1.01 eMMC-1 (71-3322) |
| BeeHive208S | adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-276 ZIF-CS (a) (70-2554A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-276 ZIF-CS (a) (70-2554A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331) |
| BeeHive304 | adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040) |
| BeeProg2 | adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-276 ZIF-CS (a) (70-2554A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-276 ZIF-CS (a) (70-2554A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331) |
| BeeProg2AP | adapter/module: AP1 BGA153-1.01 eMMC-1 (71-3322) |
| BeeProg2C | adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-276 ZIF-CS (a) (70-2554A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-276 ZIF-CS (a) (70-2554A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331) |
| BeeProg3 | adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040) |
| BeeHive204AP-AU (discontinued) | adapter/module: AP1 BGA153-1.01 eMMC-1 (71-3322) |
