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Device: JW616 [VFBGA130]

Manufacturer: Micron

Part number description for this device:

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MT Micron Technology  
XXX Product Family 27C = OneNAND + LPDRAM MCP/PoP
28C = NOR + LPDRAM MCP/PoP
29C = NAND flash + LPDRAM MCP/PoP
XX NAND Flash Density DM = 128Mbit
EM = 256Mbit
FM = 512Mbit
1G = 1Gbit
2G = 2Gbit
4G = 4Gbit
8G = 8Gbit
AG = 16Gbit
BG = 32Gbit
CG = 64Gbit
DG = 128Gbit
XXX LPDRAM Density 56M = 256Mbit
12M = 512Mbit
40M = 640Mbit
24M = 1Gbit
52M = 1152Mbit
48M = 2Gbit
72M = 3Gbit
96M = 4Gbit
92M = 8Gbit
X Operating Voltage Range A = 1.70V to 1.95V
B = 1.65V to 1.90V
C = 1.50V to 1.70V
D = 1.20V to 1.50V
F = 1.00V to 1.20V
G = 1.70 – 1.95V DRAM; 2.70 – 3.60V NOR Vcc; 1.65 – 3.60V Vccq
X NAND Flash Configuration A = x8, M28A
B = x16, M28A
C = x8, M48A
D = x16, M48A
E = x8, L58A
F = x16, L58A
G = x8, M49A
H = x16, M49A
J = x8, M59A
K = x16, M59A
L = x8, L59A
M = x16, L59A
N = x8, M50A
P = x16, M50A
R = x8, L51A
T = x16, L51A
U = x8, M58A
V = x16, M58A
Y = x8 M60A
Z = x16, M60A
AA = x8, M69A
AB = x16, M69A
AC = x8, M68A
AD = x16, M68A
AE = x8, M71M
AF = x16, M71M
AG = x8, M70M
AH = x16, M70M
AI = x8, M68M
AJ = x8, M68M
AL = x16, M61N
AH = x16 QKHP
AM = x16, M69N
AK = x16, 3F0S
X LPDRAM Configuration A = DDR, T37M x16
B = SDR, Y37M x16
C = DDR, T37M x32
D = SDR, Y37M x32
J = DDR, T48M x16
K = SDR, Y48M x16
L = DDR, T48M x32
M = SDR, Y48M x32
N = DDR, T47M x16
P = SDR, Y47M x16
R = DDR, T47M x32
T = SDR, Y47M x32
V = DDR, T67M x16
Y = DDR, T67M x32
Z = SDR, Y36N x16
AA = DDR, T36N x16
AB = DDR, T35M x32
AC = SDR, Y35M x32
AE = SDR, Y67M x16
AF = SDR, Y67M, x32
AG = SDR, Y67M x16 + Y35M x16
AH = DDR, T68M x16
AJ = SDR, Y68M x16
AK = DDR, T68M x32
AL = SDR, Y68M x32
AM = DDR, T69M x16
AN = SDR, Y69M x16
AP = DDR, T69M x32
AR = SDR, Y69M x32
AS = SDR, Y47M x16(2) + Y35M x16
AT = DDR, T48M x16(2) + T48M x32
AU = DDR, T36N x32
AV = DDR, T36N x32
AY = DDR, T69M x32 + T68M x32
AZ = DDR, T79M x16
BA = DDR, T79M x32
BB = DDR, T89M x32
X Chip Count A = 1 NAND, 1 LPDRAM (1xCE#, 1xCS#)
B = 2 NAND, 1 LPDRAM (2xCE#, 1xCS#)
C = 1 NAND, 2 LPDRAM (1xCE# 2xCS#)
D = 2 NAND, 2 LPDRAM (2xCE#, 2xCS#)
E = 1 NAND, 3 LPDRAM (1xCE#, 2xCS#)
F = 2 NAND, 3 LPDRAM (1xCE#, 2xCS#)
G = 1 NAND, 4 LPDRAM (1xCE#, 2xCS#)
H = 1 NAND, 3 LPDRAM (1xCE#, 3xCS#)
XX Package Code CA = 152-ball PoP VFBGA (14.0x14.0x0.9mm)
CG = 152-ball PoP VFBGA (14.0x14.0x1.0mm)
HC = 149-ball TFBGA (16.5x10.5x1.2mm)
JA = 137-ball TFBGA (13.0x10.5x1.2mm)
JC = 107-ball TFBGA (13.0x10.2x1.2mm)
JG = 168-ball PoP VFBGA (12.0x12.0x0.9mm)
JI = 168-ball PoP TFBGA (12.0x12.0x1.1mm)
JQ = 152-ball PoP TFBGA (14.0x14.0x1.1mm)
JR = 137-ball LFBGA (13x10.5x1.4mm)
JS = 137-ball TFBGA (13x10.5x1.4mm)
JV = 168-ball PoP VFBGA (12.0x12.0x1.0mm)
KC = 107-ball TFBGA (13x10.5x1.1mm)
KD = 137-ball TFBGA (13.0x10.5x1.1 mm)
KN = 184-ball PoP VFBGA (14.0x14.0x1.0mm)
KQ = 168-ball PoP WFBGA (12.0x12.0x0.75mm)
KS = 137-ball VFBGA (13.0x10.5x1.0mm)
MA = 168-ball PoP WFBGA (12.0x12.0x0.7mm)
MC = 240-ball PoP WFBGA (14.0x14.0x0.8mm)
MD = 130-ball VFBGA (9.0x8.0x1.0mm)
ME = 240-ball PoP TFBGA (14.0x14.0x1.12mm)
MF = 168-ball PoP VFBGA (12.0x12.0x0.85mm)
MJ = 240-ball PoP VFBGA (14.0x14.0x0.85mm)
MK = 153-ball VFBGA (12.0x10.0x0.9mm)
ML = 153-ball VFBGA (9.0x8.0x0.9mm)
MS = 191-ball PoP WFBGA (12.0x12.0x0.8mm)
NE = 133-ball VFBGA (11.0x10.0x1.0mm)
RN = 160-ball FBGA (11.5x11.5x0.94mm)
TE = 153-ball VFBGA (12.0x10.0x1.0mm)
PL = 162-ball WFBGA (13.0x11.5x0.8mm)
SK = 162-ball VFBGA (13.0x11.5x0.9mm)
SP = 192-ball WFBGA (10.5x8.0x0.8mm)
X LPDRAM Access Time 5 = 200MHz, CL3
54 = 185MHz, CL3
6 = 166MHz, CL3
75 = 133MHz, CL3
8 = 125MHz, CL3
10 = 100MHz
48 = 208MHz
X Special Options Blank = Standard
L = Low-power option
E = On-die ECC enabled
XX Operating Temperature Range IT = Industrial (-40°C to 85°C)
W = Wireless (-25°C to 85°C)
XX Production Status Blank = Production
ES = Engineering sample
MS = Mechanical sample
QS = Qualification sample
DC = Daisy chain

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176)
BeeHive208S adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176)
BeeProg2 adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176)
BeeProg2C adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176)
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