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Device: MX29LV401B [TSOP48]

Manufacturer: Macronix

Part number description for this device:

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MX Macronix  
XX Device Number 26 = High speed eLiteFlash memory
28 = FLASH
29 = Single Voltage FLASH
68 = Stack die Flash
X Process C = CMOS Flash
F = 5V Flash
L, LV = Low-Voltage, 3.3V Flash
LW = Lov-Voltage, 3.3V Pagemode Flash
LA = 3V Security
BL = 3V with Write Buffer
GL = 3V Page mode
GA = 3V Security Flash
V = 2.2V
U, SL = 1.8V
NS, VS = 1.8V Burst Mode
X = 1.5V
XXXX Capacity & Mode 004 = 512kx8, Boot block
040 = 512kx8, Equal sector
008 = 1Mx8, Boot block
080, 081 = 1Mx8, Equal sector
100 = 128kx8 / 64kx16
200 = 256kx8 / 128kx16
400, 401 = 512kx8 / 256kx16, Boot Block
800 = 1Mx8 / 512kx16
1610, 1611, 1615, 160, 161 = 2Mx8 / 1Mx16
3211, 320 = 4Mx8 / 2Mx16
640 = 8Mx8 / 4Mx16
641 = 4Mx16
001 = 128kx8
002, 002N = 256kx8
022, 022N = 256kx8
1000, 1000P = 128kx8
2000T, 2000P = 256kx8
2100 = 128kx16
8000 = 1Mx8
8100, 8100G, 800 = 1Mx8 / 512kx16
016, 017 = 2Mx8
033 = 4Mx8, Equal sector
161 = 2Mx8 / 1Mx16 or 1Mx16
321 = 8Mx8 / 2Mx16
065 = 8Mx8, Equal sector
402 = 4Mb x8/x16 boot block
128, 129 = 128Mb x8/x16 boot block
256 = 256Mb x8/x16 uniform block
257 = 256Mb x16 uniform block
1G0 = 1Gb x8/x16 architecture
X Version Blank
A = A-version
B = B-version
C = C-version
D = D-version
M = M-version
E = E-version
F = F-version
X Sector Architecture Blank
T = Top boot sector
B = Bottom boot sector
U = Equal sector
H = High sector
L = Low sector
C = Highest address sector protected with read protection
F = Lowest address sector protected with read protection
XJ = TFBGA, 0.5mm pitch, 0.3mm ball size
X Package Type P = Plastic DIP
C = Ceramic DIP
K = Skinny DIP
M = Plastic SOP
Q = PLCC
D = CerDIP
F = Plastic QFP
T = TSOP
R = TSOP reverse
X = FBGA(CSP)
XB = TFBGA(CSP), 0.8 mm ball pitch / 0.3 mm ball size
XC = FBGA(CSP), 1.0mm ball pich
XE = LFBGA, FBGA(CSP), 0.8 mm ball pitch / 0.4 mm ball size
XF = LFBGA (11mm x 13mm)
XG = TBGA(CSP), 0.8 mm ball pitch / 0.4 mm ball size
XH = WFBGA, 0.5mm ball pitch, 0.3mm ball size
XJ = TFBGA56 (7.7x6.2mm),0.5mm pitch/0.3mm ball size
XL = TFBGA56 (7.7x6.2x1.05nn)
GB = XFLGA, 0.5mm land pitch, 0.25mm land opening
X Temperature Range C = Commercial
I = Industrial
M = Military
XX Speed Option 45 = 45 ns
55 = 55 ns
70 = 70 ns
80 = 80 ns
90 = 90 ns
10 = 100 ns
11 = 110 ns
12 = 120 ns
15 = 150 ns
20 = 200 ns
X Option Blank
G = Lead-free package
Q = RoHS compliant; Vcc=3.0V to 3.6V
XX Cycling (FLASH) Blank
C3 = 1000
C4 = 10000
C5 = 100000

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: Bottom TSOP48 NOR-1 (70-1227) + Top TSOP48 ZIF 18.4mm (70-1228) Top TSOP48 ZIF 18.4mm (70-1228) + Top TSOP48 ZIF 18.4mm (70-1228)
BeeHive204AP adapter/module: AP1 TSOP48 ZIF 18.4mm NOR-1 (71-1988)
BeeHive208S adapter/module: Bottom TSOP48 NOR-1 (70-1227) + Top TSOP48 ZIF 18.4mm (70-1228) Top TSOP48 ZIF 18.4mm (70-1228) + Top TSOP48 ZIF 18.4mm (70-1228)
BeeProg2 adapter/module: Bottom TSOP48 NOR-1 (70-1227) + Top TSOP48 ZIF 18.4mm (70-1228) Top TSOP48 ZIF 18.4mm (70-1228) + Top TSOP48 ZIF 18.4mm (70-1228)
BeeProg2AP adapter/module: AP1 TSOP48 ZIF 18.4mm NOR-1 (71-1988)
BeeProg2C adapter/module: Bottom TSOP48 NOR-1 (70-1227) + Top TSOP48 ZIF 18.4mm (70-1228) Top TSOP48 ZIF 18.4mm (70-1228) + Top TSOP48 ZIF 18.4mm (70-1228)
BeeHive204AP-AU (discontinued) adapter/module: AP1 TSOP48 ZIF 18.4mm NOR-1 (71-1988)
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