Device: X28HC64
Manufacturer: Intersil
Part number description for this device:
Move the cursor over the box to highlight particular sectionX | Xicor | |
XX | Family Descriptor | 28 = EEPROM |
X | Technology | Blank = NMOS C = CMOS HC = High perfomance CMOS LV = Low-voltage CMOS TC = Fast Column Access EEPROM VC = Byte Alterable EEPROM |
XXX | Density | 04A = 512x8 16A, 16B, 16C = 2kx8 010 = 128kx8 64, 64A, 64B, 64H = 8kx8 256 = 32kx8 512 = 64kx8 |
XX | Temperature Range | Blank = Commercial I = Industrial M = Military MHR = Military high rel. processing MB = MIL-STD-883 |
X | Package Type | P = Plastic DIP J = PLCC D = CerDIP E = Ceramic LCC S = SOIC F = Flat Pack K = Pin Grid Array R = Ceramic SOIC N = Stretched Ceramic LCC T = TSOP L = TQFP |
XX | Access Time | Blank = 300 ns 25 = 250 ns 20 = 200 ns 15 = 150 ns 90 = 90 ns 70 = 70 ns 55 = 55 ns 45 = 45 ns 35 = 35 ns |
XX | Option | T1 = Tape&Reel |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
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