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Device: PF38F3050M0Y1 [SCSP88]

Manufacturer: Intel

Part number description for this device:

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XX Package Designator JZ = UT-SCSP, BT, Pb-free
LZ = UT-SCSP, Tape, leaded
NZ = UT-SCSP, BT, leaded
PC = Easy BGA, Pb-free
PF = SCSP, Pb-free
RC = Easy BGA, leaded
RD = SCSP, leaded
TE = TSOP
JS = TSOP, Pb-free
XXX Product Line Designator 38F = Stacked Flash + RAM
X Flash #1 Density 0No Die
1 = 32Mbit
2 = 64Mbit
3 = 128Mbit
4 = 256Mbit
5 = 512Mbit
6 = 1Gbit
7 = 2Gbit
8 = 4Gbit
9 = 8Gbit
A = 16Gbit
X Flash #2 Density 0No Die
1 = 32MBit
2 = 64Mbit
3 = 128Mbit
4 = 256Mbit
5 = 512Mbit
6 = 1Gbit
7 = 2Gbit
8 = 4Gbit
9 = 8Gbit
A = 16Gbit
X RAM #1 Density 0No Die
1 = 4Mbit
2 = 8Mbit
3 = 16Mbit
4 = 32Mbit
5 = 64Mbit
6 = 128Mbit
7 = 256Mbit
8 = 512Mbit
9 = 1Gbit
A = 2Gbit
X RAM #2 Density 0No Die
1 = 4Mbit
2 = 8Mbit
3 = 16Mbit
4 = 32Mbit
5 = 64Mbit
6 = 128Mbit
7 = 256Mbit
8 = 512Mbit
9 = 1Gbit
A = 2Gbit
X Flash #1 Product Family 0No die
C = Intel Advenced+Boot Block Flash memory, 3.0V core voltage
J = Intel StrataFlash memory, 3.0V core voltage
L = Intel StrataFlash Wireless memory, 1.8V core voltage
LV = Intel StrataFlash Wireless memory system, 1.8V core voltage
P = Intel StrataFlash Embedded memory, 1.8V core voltage
W = Intel Wireless Flash memory, 1.8V core voltage
M = Intel StrataFlash cellular memory
X Flash #2 Product Family 0No Die
C = Intel Advanced+Boot Block Flash memory, 3.0V core voltage
J = Intel StrataFlash memory, 3.0V core voltage
L = Intel StrataFlsh Wireless memory, 1.8V core voltage
LV = Intel StrataFlash Wireless memory system, 1.8V core voltage
P = Intel StrataFlash Embedded memory, 1.8V core voltage
W = Intel Wireless Flash memory, 1.8V core voltage
M = Intel StrataFlash cellular memory
X I/O Voltage, CE# Configuration Z = 3.0V I/0, Individual chip enables
Y = 1.8V I/0, Individual chip enables
V = 3.0V I/O, Virtual CE#
U = 1.8V I/O, Virtual CE#
R = 3.0V I/O, mixed Individual/Virtual CE#
T = 2.3V to 3.6V I/O & core, Virtual CE#
Q = 1.8V I/O, mixed Individual/Virtual CE#
X = 2.3V to 3.6V I/O & core, Individual CE#
X Parameter, Mux Configuration B = Bottom parameter, non-mux
T = Top parameter, non-mux
D = Dual parameter, non-mux
C = Bottom parameter, ADMux I/O
U = Top parameter, ADMux I/O
0Non-parameter, non-mux
1 = Non-parameter, ADMux I/O
3 = Non-parameter, full ADMux I/O
X Ballout Identifier 0Discrete
B = x16D (DRAM), 105-ball
C = x16C (PSRAM), 107-ball
L = \\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\'I\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\' ballout
P = x32
Q = QUAD/+ ballout, 88-ball
S = Sync ballout, original 96-ball version
V = x16 Split Bus, 165-ball
D = x16 LPCP ballout, 56-ball (low pin count PSRAM)
E = x16SBD, 133-ball
X Device Version 0Initial version
E = E-version
F = F-version
G = G-version
H = H-version
I = I-version
J = J-version
K = K-version

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0749/0336 (70-0749/0336) = BGA-Bottom-85 (70-0749) + BGA-Top-29 ZIF (70-0336)
BeeHive204AP adapter/module: AP1 BGA-0749/0336 (71-2119)
BeeHive208S adapter/module: BGA-0749/0336 (70-0749/0336) = BGA-Bottom-85 (70-0749) + BGA-Top-29 ZIF (70-0336)
BeeProg2 adapter/module: BGA-0749/0336 (70-0749/0336) = BGA-Bottom-85 (70-0749) + BGA-Top-29 ZIF (70-0336)
BeeProg2AP adapter/module: AP1 BGA-0749/0336 (71-2119)
BeeProg2C adapter/module: BGA-0749/0336 (70-0749/0336) = BGA-Bottom-85 (70-0749) + BGA-Top-29 ZIF (70-0336)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA-0749/0336 (71-2119)
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