Device: PF28F1602C3TD [SCSP66]
Manufacturer: Intel
Part number description for this device:
Move the cursor over the box to highlight particular section| XX | Package Type | RD = Leaded ball Stacked-CSP PF = Lead-free ball Stacked-CSP |
| XXX | Product Line Designator | 28F, 38F = Intel Flash Memory |
| XXX | Flash Density | 160 = 16Mbit(x16) 320 = 32Mbit(x16) |
| X | SRAM Device Density | 2 = 2Mbit(x16) 4 = 4Mbit(x16) 8 = 8Mbit(x16) |
| XX | Product Family | C = Advanced+Boot Block flash memory |
| X | Parameter Location | T = Top blocking B = Bottom blocking |
| X | Technology Differentiator | Blank = 0.25um or 0.18um D = 0.13um |
| XX | Access Speed | 70 = 70ns 90 = 90ns 110 = 110ns |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-0425/0336 (70-0425/0336) = BGA-Bottom-25 (70-0425) + BGA-Top-29 ZIF (70-0336) |
| BeeHive204AP | adapter/module: AP1 BGA-0425/0336 (71-2123) |
| BeeHive208S | adapter/module: BGA-0425/0336 (70-0425/0336) = BGA-Bottom-25 (70-0425) + BGA-Top-29 ZIF (70-0336) |
| BeeProg2 | adapter/module: BGA-0425/0336 (70-0425/0336) = BGA-Bottom-25 (70-0425) + BGA-Top-29 ZIF (70-0336) |
| BeeProg2AP | adapter/module: AP1 BGA-0425/0336 (71-2123) |
| BeeProg2C | adapter/module: BGA-0425/0336 (70-0425/0336) = BGA-Bottom-25 (70-0425) + BGA-Top-29 ZIF (70-0336) |
| BeeHive204AP-AU (discontinued) | adapter/module: AP1 BGA-0425/0336 (71-2123) |
