Device: 5M160Z [MBGA68]
Manufacturer: Intel
Part number description for this device:
Move the cursor over the box to highlight particular section| XX | Family Signature | 5M = MAX V |
| XXX | Device Type | 40Z = 40 logic elements 80Z = 80 logic elements 160Z = 160 logic elements 240Z = 240 logic elements 570Z = 570 logic elements 1270Z = 1270 logic elements 2210Z = 2210 logic elements |
| X | Package Type | T = Thin quad flat pack (TQFP) F = FineLine BGA (FBGA) M = Micro FineLine BGA (MBGA) E = Plastic enhanced quad flat pack (EQFP) |
| XX | Pin Count | - number of pins for particular package |
| X | Operating Temperature | C = Commercial (0°C to 85°C) I = Industrial (-40°C to 100°C) |
| X | Speed Grade | 4 or 5, with 4 being the fastest |
| X | Optional Suffix | - indicates specific device options or shipment method N = Lead-free packaging |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-2688/0957 (70-2688/0957) = BGA-Bottom-241 (70-2688) + BGA-Top-160 ZIF-CS (70-0957) |
| BeeHive208S | adapter/module: BGA-2688/0957 (70-2688/0957) = BGA-Bottom-241 (70-2688) + BGA-Top-160 ZIF-CS (70-0957) |
| BeeProg2 | adapter/module: BGA-2688/0957 (70-2688/0957) = BGA-Bottom-241 (70-2688) + BGA-Top-160 ZIF-CS (70-0957) |
| BeeProg2C | adapter/module: BGA-2688/0957 (70-2688/0957) = BGA-Bottom-241 (70-2688) + BGA-Top-160 ZIF-CS (70-0957) |
