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Device: 5M1270Z [FBGA324]

Manufacturer: Intel

Part number description for this device:

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XX Family Signature 5M = MAX V
XXX Device Type 40Z = 40 logic elements
80Z = 80 logic elements
160Z = 160 logic elements
240Z = 240 logic elements
570Z = 570 logic elements
1270Z = 1270 logic elements
2210Z = 2210 logic elements
X Package Type T = Thin quad flat pack (TQFP)
F = FineLine BGA (FBGA)
M = Micro FineLine BGA (MBGA)
E = Plastic enhanced quad flat pack (EQFP)
XX Pin Count - number of pins for particular package
X Operating Temperature C = Commercial (0°C to 85°C)
I = Industrial (-40°C to 100°C)
X Speed Grade 4 or 5, with 4 being the fastest
X Optional Suffix - indicates specific device options or shipment method
N = Lead-free packaging

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-2683/0999 (70-2683/0999) = BGA-Bottom-255 (70-2683) + BGA-Top-148 ZIF (70-0999)
BeeHive208S adapter/module: BGA-2683/0999 (70-2683/0999) = BGA-Bottom-255 (70-2683) + BGA-Top-148 ZIF (70-0999)
BeeHive304 adapter/module: AP3 BGA324-1 PLD-1 (73-3842)
BeeProg2 adapter/module: BGA-2683/0999 (70-2683/0999) = BGA-Bottom-255 (70-2683) + BGA-Top-148 ZIF (70-0999)
BeeProg2C adapter/module: BGA-2683/0999 (70-2683/0999) = BGA-Bottom-255 (70-2683) + BGA-Top-148 ZIF (70-0999)
BeeProg3 adapter/module: AP3 BGA324-1 PLD-1 (73-3842)
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