Device: 10M16DC [UBGA324](Jam)
Manufacturer: Intel
Part number description for this device:
Move the cursor over the box to highlight particular section| XX | Family Signature | 10M = MAX 10 |
| XX | Member Code | 02 = 2K logic elements 04 = 4K logic elements 08 = 8K logic elements 16 = 16K logic elements 25 = 25K logic elements 40 = 40K logic elements 50 = 50K logic elements |
| XX | Feature Options | SC = Single supply, compact features SF = Single supply, flash features SA = Single supply, analog features SL = Single supply, flash features with RSU option DC = Dual supply, compact features DF = Dual supply, flash features DA = Dual supply, analog features DD = Dual supply, analog and flash features with RSU option and flash access control |
| X | Package Type | V, Y = Wafer-level chip scale (WLCSP) E = Plastic enhanced quad flat pack (EQFP) M = Micro FineLine BGA (MBGA) U = Ultra FineLine BGA (UBGA) F = FineLine BGA (FBGA) |
| XXX | Package Code | WLCSP package type: 36 = 36-ball, 3mm x 3mm 81 = 81-ball, 4mm x 4mm 180 = 180-ball, 6mm x 5mm EQFP package type: 144 = 144-pin, 22mm x 22mm MBGA package type: 153 = 153-ball, 8mm x 8mm UBGA package type: 169 = 169-ball, 11mm x 11mm 324 = 324-ball, 15mm x 15mm FBGA package type: 256 = 256-ball, 17mm x 17mm 484 = 484-ball, 23mm x 23mm 672 = 672-ball, 27mm x 27mm |
| X | Operating Temperature | C = Commercial (0°C to 85°C) I = Industrial (-40°C to 100°C) A = Automotive (-40°C to 125°C) |
| X | FPGA Fabric Speed Grade | 6 = fastest 7 8 |
| X | Optional Suffix | - indicates specific device options or shipment method G = RoHS6 ES = Engineering sample P = Leaded package |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-3969/3970 (70-3969/3970) = BGA-Bottom-392 (70-3969) + BGA-Top-392 ZIF (70-3970) |
| BeeHive208S | adapter/module: BGA-3969/3970 (70-3969/3970) = BGA-Bottom-392 (70-3969) + BGA-Top-392 ZIF (70-3970) |
| BeeHive304 | adapter/module: AP3 BGA324-2 PLD-1 (73-4078) |
| BeeProg2 | adapter/module: BGA-3969/3970 (70-3969/3970) = BGA-Bottom-392 (70-3969) + BGA-Top-392 ZIF (70-3970) |
| BeeProg2C | adapter/module: BGA-3969/3970 (70-3969/3970) = BGA-Bottom-392 (70-3969) + BGA-Top-392 ZIF (70-3970) |
| BeeProg3 | adapter/module: AP3 BGA324-2 PLD-1 (73-4078) |
