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Device: S29GL032NxxFxx04 [FBGA64]

Manufacturer: Infineon

Part number description for this device:

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S Spansion Memory  
XX Product Series 29 = Sector erase NOR Flash memory
70 = Page-mode Flash memory
X Flash Interface And Simultaneous Read-Write J = Standard, simultaneous read-write
A = Standard, no simultaneous read-write
P = Page, simultaneous read-write
G = Page, no simultaneous read-write
W = Burst (Demux add/data), simultaneous read-write
R = Burst (Demux add/data), no simultaneous read-write
N = Burst (Mux add/data), simultaneous read-write
K = Burst (Mux add/data), no simultaneous read-write
C = Automotive burst (Demux), simultaneous read-write
V = Value family, simutaneous read-write,
burst mode flash memory with multiplexed I/O
X = Address-high, address-low, data multiplexed
X Core Voltage F = 5.0 V Vcc
L = 3.0 V Vcc
D = 2.5 V Vcc
S = 1.8V Vcc
XXX Density 001-999 = 1Mb - 999Mb
01G-64G = 1Gb - 64Gb
X Process Technology B = 320 nm, Floating gate technology
C = 320 nm, Floating gate technology
D = 200 nm, Floating gate technology
G = 170 nm, Floating gate technology
H = 130 nm, Floating gate technology
J = 110 nm, Floating gate technology
M = 230 nm, MirrorBit technology
A = 200 nm MirrorBit technology
N = 110 nm, MirrorBit technology
P = 90 nm, MirrorBit technology
K = 90 nm Floating gate technology
R = 65 nm, MirrorBit technology
S = 65nm, MirrorBit Eclipse technology
T = 45 nm, MirrorBit Eclipse technology
XX Speed Option/Clock Rate - represents random access time (ns).
If greater than 100 ns, use the two leftmost digits
Clock rate suffix:
AA = 104 MHz
0P = 66 MHz
OS = 83 MHz
AB = 104 MHz
X Package Type B = FBGA
BH = Very Thin Fine-Pitch BGA
C = CSOP (Lead Frame)
E = Super CSP (BGA)
D, F, G = Fortified BGA
M = SOIC/SOP (Lead Frame)
N = WSON (Lead Frame)
Q = Plastic QFP
T = TSOP
S = SOP
X Package Material Set Blank
A = Standard, not lead (Pb)-free
F = Standard, lead (Pb)-free
J = (Pb)-free, LF35 package
H = Low halogen, PB-free
X Temperature Range E = Engineering samples
C = Commercial (0°C to 70°C)
W = Wireless (-25°C to 85°C)
I = Industrial (-40°C to 85°C)
N = Extended (-40°C to 125°C)
A = Automotive
XX Additional Ordering Option/Model Number e.g. R0, R1, R2 ... R9, S1..S4, or other two digits number
X Packing Type 0Tray
1 = Tube
2 = 7\\\'\\\' Tape & Reel
3 = 13\'\' Tape & Reel

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0245/0724 (70-0245/0724) = BGA-Bottom-1 (70-0245) + BGA-Top-132 ZIF-CS (70-0724)
BeeHive208S adapter/module: BGA-0245/0724 (70-0245/0724) = BGA-Bottom-1 (70-0245) + BGA-Top-132 ZIF-CS (70-0724)
BeeHive304 adapter/module: AP3 BGA64-2.3 NOR-1 (73-6094) OR AP3 BGA64-2.1 NOR-1 (discontinued)
BeeProg2 adapter/module: BGA-0245/0724 (70-0245/0724) = BGA-Bottom-1 (70-0245) + BGA-Top-132 ZIF-CS (70-0724)
BeeProg2C adapter/module: BGA-0245/0724 (70-0245/0724) = BGA-Bottom-1 (70-0245) + BGA-Top-132 ZIF-CS (70-0724)
BeeProg3 adapter/module: AP3 BGA64-2.3 NOR-1 (73-6094) OR AP3 BGA64-2.1 NOR-1 (discontinued)
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