Device: S29AL008JxxFxx04 [FBGA64]
Manufacturer: Infineon
Part number description for this device:
Move the cursor over the box to highlight particular section| S | Spansion Memory | |
| XX | Product Series | 29 = Sector erase NOR Flash memory 70 = Page-mode Flash memory |
| X | Flash Interface And Simultaneous Read-Write | J = Standard, simultaneous read-write A = Standard, no simultaneous read-write P = Page, simultaneous read-write G = Page, no simultaneous read-write W = Burst (Demux add/data), simultaneous read-write R = Burst (Demux add/data), no simultaneous read-write N = Burst (Mux add/data), simultaneous read-write K = Burst (Mux add/data), no simultaneous read-write C = Automotive burst (Demux), simultaneous read-write V = Value family, simutaneous read-write, burst mode flash memory with multiplexed I/O X = Address-high, address-low, data multiplexed |
| X | Core Voltage | F = 5.0 V Vcc L = 3.0 V Vcc D = 2.5 V Vcc S = 1.8V Vcc |
| XXX | Density | 001-999 = 1Mb - 999Mb 01G-64G = 1Gb - 64Gb |
| X | Process Technology | B = 320 nm, Floating gate technology C = 320 nm, Floating gate technology D = 200 nm, Floating gate technology G = 170 nm, Floating gate technology H = 130 nm, Floating gate technology J = 110 nm, Floating gate technology M = 230 nm, MirrorBit technology A = 200 nm MirrorBit technology N = 110 nm, MirrorBit technology P = 90 nm, MirrorBit technology K = 90 nm Floating gate technology R = 65 nm, MirrorBit technology S = 65nm, MirrorBit Eclipse technology T = 45 nm, MirrorBit Eclipse technology |
| XX | Speed Option/Clock Rate | - represents random access time (ns). If greater than 100 ns, use the two leftmost digits Clock rate suffix: AA = 104 MHz 0P = 66 MHz OS = 83 MHz AB = 104 MHz |
| X | Package Type | B = FBGA BH = Very Thin Fine-Pitch BGA C = CSOP (Lead Frame) E = Super CSP (BGA) D, F, G = Fortified BGA M = SOIC/SOP (Lead Frame) N = WSON (Lead Frame) Q = Plastic QFP T = TSOP S = SOP |
| X | Package Material Set | Blank A = Standard, not lead (Pb)-free F = Standard, lead (Pb)-free J = (Pb)-free, LF35 package H = Low halogen, PB-free |
| X | Temperature Range | E = Engineering samples C = Commercial (0°C to 70°C) W = Wireless (-25°C to 85°C) I = Industrial (-40°C to 85°C) N = Extended (-40°C to 125°C) A = Automotive |
| XX | Additional Ordering Option/Model Number | e.g. R0, R1, R2 ... R9, S1..S4, or other two digits number |
| X | Packing Type | 0Tray 1 = Tube 2 = 7\\\'\\\' Tape & Reel 3 = 13\'\' Tape & Reel |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-0245/0964 (70-0245/0964) = BGA-Bottom-1 (70-0245) + BGA-Top-182 ZIF-CS (70-0964) |
| BeeHive208S | adapter/module: BGA-0245/0964 (70-0245/0964) = BGA-Bottom-1 (70-0245) + BGA-Top-182 ZIF-CS (70-0964) |
| BeeProg2 | adapter/module: BGA-0245/0964 (70-0245/0964) = BGA-Bottom-1 (70-0245) + BGA-Top-182 ZIF-CS (70-0964) |
| BeeProg2C | adapter/module: BGA-0245/0964 (70-0245/0964) = BGA-Bottom-1 (70-0245) + BGA-Top-182 ZIF-CS (70-0964) |
