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Device: IS25LP064-JG [TFBGA24]

Manufacturer: ISSI

Part number description for this device:

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IS ISSI  
XXXX Flash Product Family/SPI Operation Voltage Range 25LD = Dual SPI / 2.30V - 3.60V
25WD = Dual SPI / 1.65V - 1.95V
25CD = Dual SPI / 2.70V - 3.60V
25LP = Quad SPI / 2.30V - 3.60V
25WP = QuadSPI / 1.65V - 1.95V
25WJ = QuadSPI / 1.65V - 2.0V
XXX Density 025 = 256Kb
512 = 512Kb
010 = 1Mb
020 = 2Mb
040 = 4Mb
016 = 16Mb
032 = 32Mb
064 = 64Mb
128 = 128Mb
256 = 256Mb
512 = 512Mb
01G = 1Gb
X Die Rev. Control Blank = First rev.
X Option J = Standard
R = Dedicated RESET# pin for 16-pin SOIC/24-ball TFBGA
Q = QE bit set to 1 (Call factory)
X Package Type N = 8 pin SOIC 150mil
B = 8 pin SOIC 208mil
M = 16 pin SOIC 300mil
D = 8 pin TSSOP
E = 8 pin XSON 4x4mm
K = 8 pin WSON (5x6mm)
L = 8 pin WSON 8x6mm (Call factory)
U = 8 pin USON (2x3mm)
T = 8 pin USON (4x3mm)
V = 8 pin VVSOP 150mil
S = WLCSP (Call Factory)
G = 24 ball TFBGA (6x8mm) 4x6 ball array
H = 24 ball TFBGA (6x8mm) 5x5 ball array
W = KGD (Call factory)
X Lead-Free Package L = Lead-free
X Temperature Range E = Extended grade (-40°C to +105°C)
A1 = Automotive grade (-40°C to +85°C)
A2 = Automotive grade (-40°C to +105°C)
A3 = Automotive grade (-40°C to +125°C)

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL8/BGA24-1 ZIF-CS SFlash-1 (70-3094)
BeeHive208S adapter/module: DIL8/BGA24-1 ZIF-CS SFlash-1 (70-3094)
BeeProg2 adapter/module: DIL8/BGA24-1 ZIF-CS SFlash-1 (70-3094)
BeeProg2C adapter/module: DIL8/BGA24-1 ZIF-CS SFlash-1 (70-3094)
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