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Device: HY29F002T

Manufacturer: Hynix

Part number description for this device:

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HY Hynix  
XX Family Descriptor 29 = FLASH
27 = NAND FLASH
XX Technology LV = Low Voltage
DS = Super-Low Voltage
F = 5V Flash
XXX Density 002 = 256kx8
040, 040A = 512kx8
080 = 1Mx8
160 = 2Mx8 / 1Mx16
320 = 2Mx16
322,323 = 4Mx8 / 2Mx16
400, 400A = 512kB / 256kx16
800, 800A = 1Mx8 / 512kx16
X Boot Block Location T = Top boot block option
B = Bottom boot block option
X Package Type T = TSOP
F = FBGA
G = Plastic SOP
C = PLCC
R = Reverse TSOP
X Speed Option 45 = 45 ns
55 = 55 ns
70 = 70 ns
90 = 90 ns
12 = 120 ns
X Temperature Range Blank = Commercial
I = Industrial
X Special Instructions  

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204
BeeHive208S
BeeHive304 adapter/module: AP3 DIL48 (73-3319)
BeeProg2
BeeProg2C
BeeProg3 adapter/module: AP3 DIL48 (73-3319)
MEMprog2 (discontinued)
SmartProg2 (discontinued)
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