Device: HY27UF082G2B [TSOP48] (LGE-31)
Manufacturer: Hynix
Part number description for this device:
Move the cursor over the box to highlight particular section| HY | Hynix Memory | |
| 27 | Device Family | 27 = NAND Flash |
| X | Power Supply | U = 2.7V to 3.6V L = 2.7V S = 1.8V |
| X | Classification | S = Single Level Cell + Single Die + S/B A = Single Level Cell + Double Die + S/B B = Single Level Cell + Quadruple Die + S/B F = Single Level Cell + Single Die + L/B G = Single Level Cell + Double Die + L/B H = Single Level Cell + Quadruple Die + L/B M = Multi Level Cell + Single Die + S/B O = Multi Level Cell + Double Die + S/B P = Multi Level Cell + Quadruple Die + S/B T = Multi Level Cell + Single Die + L/B U = Multi Level Cell + Double Die + L/B V = Multi Level Cell + Quadruple Die + L/B W = Multi Level Cell + L/B |
| XX | Bit Organization | 08 = x8 16 = x16 32 = x32 |
| XX | Density | 64 = 64Mbit 28 = 128Mbit 56 = 256Mbit 12 = 512Mbit 1G = 1Gbit 2G = 2Gbit 4G = 4Gbit 8G = 8Gbit AG = 16Gbit BG = 32Gbit CG = 64Gbit DG = 128Gbit |
| X | Mode | 1 = 1nCE & 1R/nB; Sequencial Row Read Enable 2 = 1nCE & 1R/nB; Sequencial Row Read Disable 4 = 2nCE & 2R/nB; Sequencial Row Read Enable 5 = 2nCE & 2R/nB; Sequencial Row Read Disable 6 = 1nCE &1R/nB; Sequencial Row Read Enable & Auto Read Page 0 7 = 2nCE & 2R/nB; Sequencial Row Read Enable & Auto Read Page 0 8 = 1nCE &1R/nB; Sequencial Row Read Disable & Auto Read Page 0 9 = 2nCE &2R/nB; Sequencial Row Read Disable & Auto Read Page 0 D = Dual interface; Sequential Row Read Disable F = 4nCE & 4R/B; Sequencial Row Read Disable |
| X | Version | M = 1st Generation A = 2nd Generation B = 3rd Generation C = 4th Generation 1 = Down Density (1st) 2 = Down Density (2nd) |
| X | Package Type | T = TSOP V = WSOP S = USOP F = FBGA (63ball) B = FBGA (107ball) G = FBGA (149ball) H = TBGA L = LGA U = ULGA W = Wafer C = Chip K = KGB D = PGD2 |
| X | Package Material | Blank = Normal, Wafer, Chip, KGB P = Lead Free H = Halogen Free R = Lead & Halogen Free |
| X | Operating Temperature | Blank = Wafer, Chip C = 0°C to 70°C E = -25°C to 85°C M = -30°C to 85°C I = -40°C to 85°C |
| X | Bad Block | Blank = Wafer B = Included Bad Block S = 1 - 5 Bad Block P = All Good Block |
| X | Customer Initial Option |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081) |
| BeeHive204AP | adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097) |
| BeeHive208S | adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081) |
| BeeProg2 | adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081) |
| BeeProg2AP | adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097) |
| BeeProg2C | adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081) |
| BeeHive204AP-AU (discontinued) | adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097) |
