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Device: H27U1G8F2C [TSOP48] (LGE-36)

Manufacturer: Hynix

Part number description for this device:

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H Hynix  
X Product Family 2 = Flash
X Product Mode 7 = NAND Flash
X Power Supply U = 2.7V to 3.6V
L = 2.7V
S = 1.8V
XX Density 64 = 64Mb
12 = 128Mb
25 = 256Mb
51 = 512Mb
1G = 1Gb
2G = 2Gb
4G = 4Gb
8G = 8Gb
AG = 16Gb
BG = 32Gb
CG = 64Gb
DG = 128Gb
X Organization 8 = x8
16 = x16
X NAND Classification S = SLC + Single die + Small block
A = SLC + Double die + Small block
B = SLC + Quadrupple die + Small block
F = SLC + Single die + Large block
G = SLC + Double die + Large block
H = SLC + Quadruple die + Large block
K = SLC + DSP + Large block
T = MLC + Single die + Large block
U = MLC + Double die + Large block
V = MLC + Quadruple die + Large block
W = MLC + DSP + Large block
X Function Mode 1 = 1nCE & 1R/nB, Sequential row read enable
2 = 1nCE & 1R/nB, Sequential row read disable
4 = 2nCE & 2R/nB, Sequential row read enable
5 = 2nCE & 2R/nB, Sequential row read disable
D = Dual interface, Sequential row read disable
F = 4nCE & 4R/nB, Sequential row read disable
X Die Generation M = 1st generation
A = 2nd generation
B = 3rd generation
C = 4th generation
X Package Type T = TSOP1
V = WSOP
S = USOP
W = Wafer
D = PGD2
Y = TLGA
U = ULGA
F = FBGA
C = PGD1 (chip)
K = KGD
X Package Material A = Wafer
P = Lead free
L = Leaded
R = Lead & Halogen free
X Bad Block B = Included bad block
S = 1~5 bad block included
P = All good block
X Operation Temperature C = Commercial (0°C to 70°C)
E = Extended (-25°C to 85°C)
M = Mobile (-30°C to 85°C)
I = Industrial (-40°C to 85°C)

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeHive204AP adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097)
BeeHive208S adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeProg2 adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeProg2AP adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097)
BeeProg2C adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeHive204AP-AU (discontinued) adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097)
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