Device: H27U1G8F2B [TSOP48]
Manufacturer: Hynix
Part number description for this device:
Move the cursor over the box to highlight particular section| H | Hynix | |
| X | Product Family | 2 = Flash |
| X | Product Mode | 7 = NAND Flash |
| X | Power Supply | U = 2.7V to 3.6V L = 2.7V S = 1.8V |
| XX | Density | 64 = 64Mb 12 = 128Mb 25 = 256Mb 51 = 512Mb 1G = 1Gb 2G = 2Gb 4G = 4Gb 8G = 8Gb AG = 16Gb BG = 32Gb CG = 64Gb DG = 128Gb |
| X | Organization | 8 = x8 16 = x16 |
| X | NAND Classification | S = SLC + Single die + Small block A = SLC + Double die + Small block B = SLC + Quadrupple die + Small block F = SLC + Single die + Large block G = SLC + Double die + Large block H = SLC + Quadruple die + Large block K = SLC + DSP + Large block T = MLC + Single die + Large block U = MLC + Double die + Large block V = MLC + Quadruple die + Large block W = MLC + DSP + Large block |
| X | Function Mode | 1 = 1nCE & 1R/nB, Sequential row read enable 2 = 1nCE & 1R/nB, Sequential row read disable 4 = 2nCE & 2R/nB, Sequential row read enable 5 = 2nCE & 2R/nB, Sequential row read disable D = Dual interface, Sequential row read disable F = 4nCE & 4R/nB, Sequential row read disable |
| X | Die Generation | M = 1st generation A = 2nd generation B = 3rd generation C = 4th generation |
| X | Package Type | T = TSOP1 V = WSOP S = USOP W = Wafer D = PGD2 Y = TLGA U = ULGA F = FBGA C = PGD1 (chip) K = KGD |
| X | Package Material | A = Wafer P = Lead free L = Leaded R = Lead & Halogen free |
| X | Bad Block | B = Included bad block S = 1~5 bad block included P = All good block |
| X | Operation Temperature | C = Commercial (0°C to 70°C) E = Extended (-25°C to 85°C) M = Mobile (-30°C to 85°C) I = Industrial (-40°C to 85°C) |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081) |
| BeeHive204AP | adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097) |
| BeeHive208S | adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081) |
| BeeHive304 | adapter/module: AP3 TSOP48-18.4mm NAND (73-2948) |
| BeeProg2 | adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081) |
| BeeProg2AP | adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097) |
| BeeProg2C | adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081) |
| BeeProg3 | adapter/module: AP3 TSOP48-18.4mm NAND (73-2948) |
| BeeHive204AP-AU (discontinued) | adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097) |
