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Device: 27HC64

Manufacturer: General Instrument

Part number description for this device:

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XX Family Designator 27 = EPROM memory
XX Technology Blank
HC = High Speed CMOS
C = CMOS
XXX Density 04 = 512x8
16 = 2kx8
64 = 8kx8
128 = 16kx8
256 = 32kx8
512 = 64kx8
513 = PAGE
641 = 8kx8
1024 = 128kx8 / 64kx16
X Power Supply L = Low Power
XX Access Time 15 = 150 ns
17 = 170 ns
20 = 200 ns
25 = 250 ns
X Temperature Range Blank, C = Commercial
I = Industrial
M = Military
X Screening Blank = Standard commercial screening
R = Screening per MIL STD 883C Method 5004
/    
XX Package Type Blank = CerDIP
P = Plastic DIP
D = Sidebrazed ceramic
KA = Ceramic LCC
KB = Ceramic LCC, thermally enchance
L = PLCC

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204
BeeHive208S
BeeHive304 adapter/module: AP3 DIL48 (73-3319)
BeeProg2
BeeProg2C
BeeProg3 adapter/module: AP3 DIL48 (73-3319)
MEMprog2 (discontinued)
SmartProg2 (discontinued)
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