Device: 27HC64
Manufacturer: General Instrument
Part number description for this device:
Move the cursor over the box to highlight particular sectionXX | Family Designator | 27 = EPROM memory |
XX | Technology | Blank HC = High Speed CMOS C = CMOS |
XXX | Density | 04 = 512x8 16 = 2kx8 64 = 8kx8 128 = 16kx8 256 = 32kx8 512 = 64kx8 513 = PAGE 641 = 8kx8 1024 = 128kx8 / 64kx16 |
X | Power Supply | L = Low Power |
XX | Access Time | 15 = 150 ns 17 = 170 ns 20 = 200 ns 25 = 250 ns |
X | Temperature Range | Blank, C = Commercial I = Industrial M = Military |
X | Screening | Blank = Standard commercial screening R = Screening per MIL STD 883C Method 5004 |
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XX | Package Type | Blank = CerDIP P = Plastic DIP D = Sidebrazed ceramic KA = Ceramic LCC KB = Ceramic LCC, thermally enchance L = PLCC |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
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