Device: MC9RS08KA1
Manufacturer: Freescale Semic.
Part number description for this device:
Move the cursor over the box to highlight particular section| XXX | Product Qualification | MC, DSP = Fully qualified XC = Partially qualified PC = Product engineering KMC, KXC = Sample pack |
| X | Memory Type | 9 = Flash |
| XXXX | Core Type | S08 = HCS08 |
| XX | Family | |
| XXX | Approx. Flash Density | |
| X | Version | Blank A = A-version |
| X | Temperature | C = Commercial V = Automotive M = Military |
| XX | Package Type | PA, PC = PDIP8 PB, PG = PDIP16 PJ = PDIP20 P = PDIP28 B = SDIP42 DN, SC = NB SOIC8 WJ = SOIC20 DW, WL = SOIC28 DT, TG = TSSOP16 TJ = TSSOP20 TL = TSSOP28 FQ = DFN8 FB, FU = QFP44 FF = QFN16 FK = QFN24 FC, FM = QFN32 FD, FT, GT = QFN48 EP = QFN64 FJ, LC = LQFP32 FG, LD = LQFP44 FAE, LF = LQFP48 PU, LH = LQFP64 FU = (L)QFP64 LK = LQFP80 LL = LQFP100 |
| X | Special | Blank E = Lead free |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | |
| BeeHive208S | |
| BeeHive304 | adapter/module: AP3 DIL48 (73-3319) |
| BeeProg2 | |
| BeeProg2C | |
| BeeProg3 | adapter/module: AP3 DIL48 (73-3319) |
