Device: FMN4SD2DBK-xxxB [FBGA137]
Manufacturer: Fidelix
Part number description for this device:
Move the cursor over the box to highlight particular section| FM | Fidelix Memory | |
| N | Product Family | N = NAND + Mobile DRAM MCP |
| X | Flash Density | 6 = 256Mbit 5 = 512Mbit 1 = 1Gbit 2 = 2Gbit 4 = 4Gbit |
| X | Flash Organization | E = x8 S = x16 |
| X | SDR/DDR | S = SDR D = DDR T = DDR2 |
| X | SDR/DDR Density | 3 = 128Mbit 6 = 256Mbit 5 = 512Mbit 1 = 1Gbit 2 = 2Gbit |
| X | SDR/DDR Organisation | S = x16 T = x32 D = x32 (Double stack) |
| X | Core/IO Voltage (Flash/DRAM) | A = 3.3V / 1.8V B = 1.8V / 1.8V C = 1.8V / 1.2V |
| X | Index | NAND generation |
| XX | DRAM Speed | 15 = 66MHz 12 = 83MHz 10 = 100MHz 75 = 133MHz 60 = 166MHz 50 = 200MHz 25 = 400MHz 18 = 533MHz |
| X | Temperature Range | C = 0°C to 70°C E = -25°C to 85°C I = -40°C to 85°C |
| X | Package Type | A = 9.0x8.0mm, 130-ball FBGA, 1.0Tmax. B = 13.0x10.5mm, 137-ball FBGA C = 13.0x10.5mm, 107-ball FBGA D = 9.0x8.0mm, 130-ball FBGA, 1.2Tmax. E = 8.0x8.0mm, 121-ball FBGA, 0.86T max. F = 13.0x11.5mm, 162-ball FBGA, 1.0T max. G = 10.5x8.0mm, 162-ball FBGA, 0.8T max. H = 10.5x8.0mm, 162-ball FBGA, 0.8T max. |
| X | Packing Type | T = Tray R = Tape and Reel |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: DIL48/BGA137-1 ZIF NAND-1 (70-3113) |
| BeeHive208S | adapter/module: DIL48/BGA137-1 ZIF NAND-1 (70-3113) |
| BeeProg2 | adapter/module: DIL48/BGA137-1 ZIF NAND-1 (70-3113) |
| BeeProg2C | adapter/module: DIL48/BGA137-1 ZIF NAND-1 (70-3113) |
