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Device: ES29DL323T [FBGA48]

Manufacturer: Excel Semiconduct.

Part number description for this device:

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ES Excel Semiconductor  
XX Component Group 29 = Flash memory
XX Power Supply and Interface F = 5.0 V
LV = 3.0 V
DL = 3.0 V, Dual bank
DS = 1.8 V, Dual bank
BDS = 1.8 V, Burst mode, Dual bank
XXX Density and Organization 400 = 512kx8 / 256kx16
800 = 1Mx8 / 512kx16
160 = 2Mx8 / 1Mx16
320 = 4Mx8 / 2Mx16
640 = 8Mx8 / 4Mx16
X Technology D = 0.18 um
E = 0.15 um
F = 0.13 um
X Sector Architectue Blank = Uniform sector
T = Top sector
B = Bottom sector
XX Speed Option 70 = 70 ns
80 = 80 ns
90 = 90 ns
12 = 120 ns
X Package Type T = TSOP
W = FBGA
S = SOP
X Pb-free C = Pb product
G = Pb-free product
X Temperature Range Blank = Commercial (0°C to 70°C)
I = Industrial (-40°C to 85°C)

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0245/0517 (70-0245/0517) = BGA-Bottom-1 (70-0245) + BGA-Top-78 ZIF-CS (70-0517)
BeeHive208S adapter/module: BGA-0245/0517 (70-0245/0517) = BGA-Bottom-1 (70-0245) + BGA-Top-78 ZIF-CS (70-0517)
BeeProg2 adapter/module: BGA-0245/0517 (70-0245/0517) = BGA-Bottom-1 (70-0245) + BGA-Top-78 ZIF-CS (70-0517)
BeeProg2C adapter/module: BGA-0245/0517 (70-0245/0517) = BGA-Bottom-1 (70-0245) + BGA-Top-78 ZIF-CS (70-0517)
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