Device: S72XS256RE0AHBJ [FBGA133]
Manufacturer: Cypress
Part number description for this device:
Move the cursor over the box to highlight particular section| S | Spansion Memory | |
| XX | Product Series | 72 = Multi-chip product (MCP) |
| X | Flash Interface And Simultaneous Read-Write | J = Standard, simultaneous read-write A = Standard, no simultaneous read-write P = Page, simultaneous read-write G = Page, no simultaneous read-write W = Burst (Demux add/data), simultaneous read-write R = Burst (Demux add/data), no simultaneous read-write N = Burst (Mux add/data), simultaneous read-write K = Burst (Mux add/data), no simultaneous read-write C = Automotive burst (Demux), simultaneous read-write V = Simultaneous Read/Write, Burst mode with multiplexed I/O X = Address-high, address-low, data multiplexed |
| X | Core Voltage | F = 5.0 V Vcc L = 3.0 V Vcc D = 2.5 V Vcc S = 1.8V Vcc |
| XXX | Density | 001-999 = 1Mb - 999Mb 01G-64G = 1Gb - 64Gb |
| X | Process Technology | B = 320 nm, Floating gate technology C = 320 nm, Floating gate technology D = 200 nm, Floating gate technology G = 170 nm, Floating gate technology H = 130 nm, Floating gate technology J = 110 nm, Floating gate technology M = 230 nm, MirrorBit technology A = 200 nm MirrorBit technology N = 110 nm, MirrorBit technology P = 90 nm, MirrorBit technology K = 90 nm, Floating gate technology R = 65 nm, MirrorBit technology |
| XX | DRAM and Data Flash Density | D0 = 128Mb DRAM, no Data Flash E0 = 256Mb DRAM, no Data Flash |
| XX | Package Type | AF = Thin profile Fine-pitch BGA Pb-free package (0.5 mm pitch, 1.0 mm height) AJ = Thin profile Fine-pitch BGA Pb-free LF35 package (0.5 mm pitch, 1.0 mm height) ZJ = Thin profile Fine-pitch BGA Pb-free LF35 package (0.5 mm pitch, 1.2 mm height) |
| X | Temperature Range | Blank E = Engineering samples C = Commercial (0°C to 70°C) W = Wireless (-25°C to 85°C) I = Industrial (-40°C to 85°C) N = Extended (-40°C to 125°C) |
| X | Package Modifier | 1 = DDR DRAM, 133-ball, 8.0x8.0 mm, FBGA multi-chip package 7 = DDR DRAM, 133-ball, 11x10 mm, FBGA multi-chip package |
| X | Model Number | K = DRAM type 1, 66 MHz flash/133 Mhz DRAM J = DRAM type 1, 80 MHz flash/133 MHz DRAM 3 = DRAM type 5, 66 MHz flash/133 MHz DRAM 2 = DRAM type 5, 80 MHz flash/133 MHz DRAM |
| X | Packing Type | 0Tray 1 = Tube 2 = 7\\\'\\\' Tape & Reel 3 = 13\'\' Tape & Reel |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-1135/1051 (70-1135/1051) = BGA-Bottom-194 (70-1135) + BGA-Top-203 ZIF-CS (70-1051) |
| BeeHive208S | adapter/module: BGA-1135/1051 (70-1135/1051) = BGA-Bottom-194 (70-1135) + BGA-Top-203 ZIF-CS (70-1051) |
| BeeProg2 | adapter/module: BGA-1135/1051 (70-1135/1051) = BGA-Bottom-194 (70-1135) + BGA-Top-203 ZIF-CS (70-1051) |
| BeeProg2C | adapter/module: BGA-1135/1051 (70-1135/1051) = BGA-Bottom-194 (70-1135) + BGA-Top-203 ZIF-CS (70-1051) |
