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Device: S25FL064P [SO16]

Manufacturer: Cypress

Part number description for this device:

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S Spansion  
XXXX Family Descriptor 25FL = CMOS 3.0V-only, SPI Flash memory
XXX Density 001 = 1Mbit
002 = 2Mbit
004, 040 = 4Mbit
008 = 8Mbit
016 = 16Mbit
032, 032P = 32Mbit
064, 064P = 64Mbit
128, 129 = 128Mbit
X Device Technology D = 0.25 µm process technology
A = 0.20um MirrorBit™
P = 0.09um MirrorBit™
XX Speed 0F = 25MHz
0L = 50MHz
0X = 104MHz
X Package Type M = SOIC8 (200mil), SOIC16(300mil)
N = USON8, WSON8
B = 24-ball BGA 6x8 package, 1.00 mm pitch
X Package Materials A = Standard
F = Lead (Pb)-free
H = Low-Halogen, Lead (Pb)-free
X Temperature Range C = Commercial (0°C to 70°C)
I = Industrial (-40°C to 85°C)
V = Automotive In-cabin (–40°C to +105°C)
XX Additional Ordering Options 00 = No additional ordering options
00 = Uniform sector (S25FL040A)
01 = Top boot sector (S25FL040A)
02 = Bottom boot sector (S25FL040A)
00 = Uniform 64kB sector product (S25FL128P, S25FL129P)
01 = Uniform 256kB sector product (S25FL128P, S25FL129P)
00 = S0-8 Narrow 150mil package (S25FL002D)
01 = S0-8 Wide 208 mil package (S25FL002D)
02 = 5x5 pin configuration BGA package (S25FL032P,S25FL064P)
03 = 6x4 pin configuration BGA package (S25FL032P,S25FL064P)
01 = 8-pin SO package / 8-contact USON package (S25FL032P)
00 = 16-pin SO package, 8-contact WSON package (S25FL064P)
31 = 6x4 pin configuration BGA package, Uniform 256 KB sectors (S25FL0129P)
30 = 6x4 pin configuration BGA package, Uniform 64 KB sectors (S25FL0129P)
21 = 5x5 pin configuration BGA package, Uniform 256 KB sectors (S25FL0129P)
20 = 5x5 pin configuration BGA package, Uniform 64 KB sectors (S25FL0129P)
01 = SO/WSON package, Uniform 256 KB sectors (S25FL0129P)
00 = SO/WSON package, Uniform 64 KB sectors (S25FL0129P)
X Packing Type 0Tray
1 = Tube (standard)
3 = 13\'\' Tape & Reel

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL16W/SOIC16 ZIF 300mil SFlash-1a (70-1272A)
BeeHive204AP adapter/module: AP1 SOIC16 ZIF 300mil SFlash-1a (71-3096)
BeeHive208S adapter/module: DIL16W/SOIC16 ZIF 300mil SFlash-1a (70-1272A)
BeeHive304 adapter/module: AP3 SOIC16-300 SFlash-1a (73-4441) OR AP3 SOIC16-300 SFlash-1 (discontinued)
BeeProg2 adapter/module: DIL16W/SOIC16 ZIF 300mil SFlash-1a (70-1272A)
BeeProg2AP adapter/module: AP1 SOIC16 ZIF 300mil SFlash-1a (71-3096)
BeeProg2C adapter/module: DIL16W/SOIC16 ZIF 300mil SFlash-1a (70-1272A)
BeeProg3 adapter/module: AP3 SOIC16-300 SFlash-1a (73-4441) OR AP3 SOIC16-300 SFlash-1 (discontinued)
BeeHive204AP-AU (discontinued) adapter/module: AP1 SOIC16 ZIF 300mil SFlash-1a (71-3096)
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