Device: PALC16R4
Manufacturer: Cypress
Part number description for this device:
Move the cursor over the box to highlight particular section| XXXXX | Device Type | PALC = CMOS PAL PALCE = Erasable CMOS PAL PLDC = CMOS PLD CY = Erasable programmable logic device CG = CMOS PLD with JEDEC PLCC pinout |
| XXXXXX | Device Number e.g. | 16R8 = PAL 20 22V10 = PAL 24 variable product terms 16V8 = Flash-erasable PAL 20 20G10 = Generic PLD 24 7C335 = Universal synchronous EPLD 7C3741B = MAX 340 erasable CPLD 7C3741 = Flash-erasable CPLD 20RA10 = Asynchronous outputs 7C324 = Asynchronous outputs with JEDEC pinout |
| XX | Speed Option | - in ns or MHz |
| X | Package Type | A = Thin quad plastic flatpack (TQFP) B = Plastic pin grid array (PPGA) D = Ceramic dual in-line package/Brazed DIP E = Tape automated bonding (TAB) F = Flatpack (solder-sealed flat package) G = Pin grid array (PGA) H = Windowed leaded chip carrier J = Plastic leaded chip carrier (PLCC) K = Cerpack (Glass-sealed flat package) L = Leadless chiop carrrier (LCC) N = Plastic quad flatpack (PQFP) P = Plastic dual in-line (PDIP) Q = Windowed leadless chip carrier (LCC) Q = Quarter size outline package (for PALCE16V8 and PALCE20V8 only) R = Windowed pin grid array (PGA) S = SOIC (gull wing) T = Windowed cerpack U = Ceramic quad flatpack (CQFP) V = SOIC (J lead) W = Windowed ceramic dual in-line package (CerDIP) X = DICE (waffle pack) Y = Ceramic leaded chip carrier BB = Fine pitch ball grid array (FBGA) BG = Ball grid array NT = Thermally enhanced plastic quad flat pack (EQFP) MB = Self boot – Fine pitch ball grid array (FBGA) MG = Self boot – Ball grid array (BGA) |
| X | Temperature Range | C = Commercial I = Industrial M = Military |
| X | Processing | Blank = Level 2 processing for commercial product B = MIL-STD-883C for military product T = Surface-mounted devices to be tape and reeled R = Level 2 processing on tape and reeled devices |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
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