Device: Pm25LD040 [WSON8]
Manufacturer: Chingis
Part number description for this device:
Move the cursor over the box to highlight particular section| Pm | ||
| XX | Family Descriptor | 25 = Serial Flash Memory with SPI interface 37 = Dual-Voltage Multiple-Cycle-Programmable ROM 29 = FLASH 39 = Flash memory 49 = Firmware Hub / LPC Flash memory |
| X | Technology | LV = Low-voltage, 3.3V Flash F = 5V FLASH FL = 3.3V-only (for Firmware hub) LD = Low voltage 2.3V-3.6V, Dual SPI mode LQ = Serial SPI Flash, Quad I/O mode |
| XXX | Density | 256C = 32kx8 512, 512A, 512C, 512R = 64kx8 010, 010A, 010C, 010R = 128kx8 002, 020, 020C = 256kx8 004, 104R, 040, 040C = 512kx8 080B, 080C = 1Mx8 016, 016B, 016C = 2Mx8 032C = 4Mx8 |
| X | Boot Block Location | T = Top Boot Block B = Bottom Boot Block |
| XX | Speed Option | 33 = 30 ns 55 = 55 ns 90 = 90 ns 12 = 120 ns 100 = 33Mhz normal read, 100MHz fast read |
| X | Package Type | D = TSSOP8 P = Plastic DIP J = PLCC S = SOIC8 (150mil) B = SOIC8 (200mil) M = SOIC16 (300mil) E, V = TSOP K, Q = WSON8 (6x5mm) |
| X | Temperature Range | C = Commercial (-40°C to +125°C) |
| X | Environmental Attribute | Blank = Standard package E = Lead-free (Pb-free) package |
| X | Packing Type | Blank = Tube R = Tape & Reel |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result page