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Device: AS29F040DCG

Manufacturer: Austin Semic. Inc.

Part number description for this device:

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AS Austin Semiconductor  
XXX Family Signature 28F = FLASH memory
8F = FLASH memory
8E = EEPROM memory
XXXXX Density 010 = 128kx8
512k32 = 512kx32, 1Mx16, 2Mx8
512k8 = 512kx8
040 = 512kx8
XXX Package Type ECA = Ceramic LCC
F = Ceramic Flat Pack
SF = Radiation shielded ceramic FP
CW = 600mil DIP
DCJ = Ceramic SOJ
DG = Plastic SOP
Q = Ceramic QFP
P = PGA
DCG = 32-pin Lead formed Flatpack
XX Speed Option 55 = 55 ns
60 = 60 ns
70 = 70 ns
90 = 90 ns
12, 120 = 120 ns
15, 150 = 150 ns
17 = 170 ns
20 = 200 ns
25 = 250 ns
30 = 300 ns
/    
XX Operating Temperature XT = military
IT = industrial
883C = Full Military Processing
Q = QML Processing

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL44/SOIC44 ZIF-CS (70-0043)
BeeHive208S adapter/module: DIL44/SOIC44 ZIF-CS (70-0043)
BeeProg2 adapter/module: DIL44/SOIC44 ZIF-CS (70-0043)
BeeProg2C adapter/module: DIL44/SOIC44 ZIF-CS (70-0043)
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