Device: EPM7512B [FBGA256]
Manufacturer: Altera
Part number description for this device:
Move the cursor over the box to highlight particular sectionXXX | Family Signature | EP = APEX, ACEX or Classic family EPF = FLEX family EPC, EPCE = Configuration devices EPM = MAX family EPCS = Serial configurations devices EPCQ = Quad-Serial configurations devices |
XXXXXXX | Device Type Number | |
X | Package Type | B = Ball-grid array (BGA) D = Ceramic dual in-line package (CerDIP) F = FineLine BGA G = Ceramic pin-grid array (PGA) J = Ceramic JLCC L = Plastic J-lead chip carrier (PLCC) P = Plastic dual in-line package (PDIP) Q = Plastic quad flat pack (PQFP) R = Power quad flat pack (RQFP) S = Plastic small-outline integrated circuit (SOIC) T = TQFP U = Ultra FineLine BGA |
X | Operating Temperature | C = Commercial (0°C to 85°C) I = Industrial (-40°C to 100°C) A = Automotive (-40°C to 125°C) M883B = Military (-55°C to 125°C) for MAX family: C = Commercial (0°C to 90°C) I = Industrial (-40°C to 105°C) A = Automotive (-40°C to 125°C) M883B = Military (-55°C to 125°C) |
XXX | Pin Count | - number of pins for devices with different pin-count options |
X | Speed Grade | 3 = 3 ns 4 = 4 ns 5 = 5 ns 6 = 6 ns 7 = 7.5 ns 10 = 10 ns 12 = 12 ns 15 = 15 ns 20 = 20 ns 25 = 25 ns 30 = 30 ns 35 = 35 ns 45 = 45 ns 50 = 50 ns 55 = 55 ns |
X | Optional Suffix | - indicates specific device options or shipment method C = carrier DX = FLEX 10K devices with CloclLock & ClockBoost circuitry ES = Engineering sample F = Fixed programming algorithm H = Special dry-packaging shipment option for MAX7000 devices P = Special PCI compliance on selecected devices T = Devices permanently set in turbo (high-speed) mode X = APEX 20K, APEX 20KE, FLEX 10K, and FLEX 10KE devices with PLLs and LVDS, if applicable V = 5.0 V tolerant inputs N = Lead-free |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
BeeHive204 | adapter/module: BGA-0502/0453A (70-0502/0453A) = BGA-Bottom-43 (70-0502) + BGA-Top-44 ZIF (a) (70-0453A) |
BeeHive204AP | adapter/module: AP1 BGA-0502/0453 (71-2109) |
BeeHive208S | adapter/module: BGA-0502/0453A (70-0502/0453A) = BGA-Bottom-43 (70-0502) + BGA-Top-44 ZIF (a) (70-0453A) |
BeeHive304 | adapter/module: AP3 BGA256-3 PLD-3 (73-3869) |
BeeProg2 | adapter/module: BGA-0502/0453A (70-0502/0453A) = BGA-Bottom-43 (70-0502) + BGA-Top-44 ZIF (a) (70-0453A) |
BeeProg2AP | adapter/module: AP1 BGA-0502/0453 (71-2109) |
BeeProg2C | adapter/module: BGA-0502/0453A (70-0502/0453A) = BGA-Bottom-43 (70-0502) + BGA-Top-44 ZIF (a) (70-0453A) |
BeeProg3 | adapter/module: AP3 BGA256-3 PLD-3 (73-3869) |
BeeHive204AP-AU (discontinued) | adapter/module: AP1 BGA-0502/0453 (71-2109) |